An electronic device including an electromagnetic shielding structure is provided. The electronic device includes a printed circuit board, an antenna module, and an electromagnetic wave shielding structure. The antenna module includes a radio frequency integrated circuit mounted on the printed circuit board, and an array antenna coupled to an upper portion of the radio frequency integrated circuit. The electromagnetic wave shielding structure surrounds a side portion of the antenna module.

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

The present disclosure provides a packaging structure and a packaging method for an antenna. The packaging structure comprises a redistribution layer, having a first surface and an opposite second surface; a first metal joint pin, formed on the second surface of the redistribution layer; a first packaging layer, disposed on the redistribution layer covering the first metal joint pin; a first antenna metal layer, patterned on the first packaging layer, and a portion of the first antenna metal layer electrically connects with the first metal joint pin; a second metal joint pin, formed on the first antenna metal layer; a second packaging layer, disposed on the first antenna metal layer covering the second metal joint pin; a second antenna metal layer, formed on the second packaging layer; and a metal bump and an antenna circuit chip, bonded to the first surface of the redistribution layer.

Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

The present disclosure provides an antenna package structure and packaging method. The package structure includes: a metal joint pin fabricated by using a wire bonding process; and a packaging layer, covering the metal joint pin. An antenna circuit chip and an antenna metal layer are electrically connected to two ends of the antenna feeder package structure.

A multi-layer circuit structure (110) has multiple layers stacked along a vertical direction. Further, at least one cavity region (120) is formed at an edge of the multi-layer circuit structure (110). The at least one cavity region (120) is formed of multiple non-conductive vias from which a dielectric substrate material of the multi-layer circuit structure (120) is removed. Further, the device comprises at least one vertical antenna patch (130) arranged in the at least one cavity region (120).

A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.

A semiconductor device including a chip package and an antenna package disposed on the chip package is provided. The chip package includes a semiconductor chip, an encapsulation enclosing the semiconductor chip, and a redistribution structure disposed on the semiconductor chip and the encapsulation and electrically coupled to the semiconductor chip. The antenna package includes an antenna pattern electrically coupled to the chip package, and an intermediate structure disposed between the antenna pattern and the chip package, wherein the intermediate structure comprises a ceramic element in contact with the redistribution structure and thermally dissipating a heat generated from the semiconductor chip.

Included are: a first dielectric substrate provided with a first conductor ground plane on a front or back surface thereof; a plurality of patch antennas formed in the first conductor ground plane, a plurality of conductive members, ends of which connected to the first conductor ground plane to surround the patch antennas individually, and a second conductor ground plane connected to each of the other ends of the conductive members, and parts of the plurality of conductive members penetrate the first dielectric substrate, and the remaining parts of the conductive members function as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane.