A phased array antenna which can change the configuration of the phased array antenna by controllable quad switches on the phased array antenna is presented. The phased array antenna adapts monolithic microwave integrate circuit (MMIC) technology to have high isolation interconnection of the reconfigurable phased array antenna. The reconfigurable phased array antenna can be reusable and adaptable to different configurations so that the overall cost and lead time of the phased array antenna is reduced compared to the existing RF antennas in the market.

The present disclosure provides a packaging structure and a packaging method for an antenna. The packaging structure comprises a redistribution layer, having a first surface and an opposite second surface; a first metal joint pin, formed on the second surface of the redistribution layer; a first packaging layer, disposed on the redistribution layer covering the first metal joint pin; a first antenna metal layer, patterned on the first packaging layer, and a portion of the first antenna metal layer electrically connects with the first metal joint pin; a second metal joint pin, formed on the first antenna metal layer; a second packaging layer, disposed on the first antenna metal layer covering the second metal joint pin; a second antenna metal layer, formed on the second packaging layer; and a metal bump and an antenna circuit chip, bonded to the first surface of the redistribution layer.

In some embodiments, an apparatus may include a conductive planar structure having a plurality of antenna elements and a plurality of cutout portions. The plurality of cutout portions may define a combiner circuit including an output interface and including a combiner circuit coupled between each of the plurality of antenna elements and the output interface.

An array antenna apparatus includes: a wiring substrate having a plurality of fed patch antennas and a plurality of active element circuits electrically connected to the plurality of fed patch antennas, respectively; and a plurality of antenna substrates each having a parasitic patch antenna. The plurality of antenna substrates are joined onto one wiring substrate. Thereby, it becomes possible to provide an array antenna apparatus that can be reduced in size and has excellent antenna characteristics.

Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.

A connected-DRA array including: a plurality of DRAs each having at least one volume of non-gaseous dielectric material; each of the plurality of DRAs having a proximal end and a distal end, and an overall height, H, from the proximal end to the distal end; wherein each of the plurality of DRAs is physically connected to at least one other of the plurality of DRAs via a relatively thin connecting structure being relatively thin as compared to an overall outside dimension of one of the plurality of DRAs, each connecting structure having a cross sectional overall height, h, as observed in the elevation view of the connected-DRA array, that is less than the overall height, H, of a respective connected DRA and being formed of a thin sheet of the at least one volume of non-gaseous dielectric material; wherein the thin sheet extends over a substantial portion of the connected-DRA array as observed in a plan view of the connected-DRA array.

An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.

A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).