Antenna arrays, including a broadband single or dual polarized, tightly coupled radiator arrays.

An illustrative example antenna device includes a substrate. A plurality of conductive members in the substrate establish a substrate integrated waveguide. A plurality of first and second slots are on an exterior surface of a first portion of the substrate. Each of the second slots is associated with a respective one of the first slots. The first and second slots are configured to establish a radiation pattern that varies across a beam of radiation emitted by the antenna device. A plurality of parasitic interruptions include slots on the exterior surface of a second portion of the substrate. The parasitic interruptions reduce ripple effects otherwise introduced by adjacent antennas.

Disclosed is a liquid crystal panel of a scanning antenna including a transmission and/or reception region in which a plurality of antenna units are arrayed, and a non-transmission and/or reception region, the liquid crystal panel including: a TFT substrate provided with a first dielectric substrate, a TFT supported by the first dielectric substrate, a gate bus line, a source bus line, and a patch electrode; a slot substrate provided with a second dielectric substrate, and a slot electrode formed on a first main surface of the second dielectric substrate and including a slot arranged so as to correspond to the patch electrode; a liquid crystal layer provided between the TFT substrate and the slot substrate and including a plurality of liquid crystal regions; and a plurality of sealing portions that respectively surround the plurality of liquid crystal regions and bond the TFT substrate and the slot substrate together. Each of the plurality of antenna units includes one of the plurality of liquid crystal regions.

According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.

Examples disclosed herein relate to a wireless device having a plurality of metastructure switched antennas, each metastructure switched antenna having an array of metastructures. A controller in the wireless device selects a metastructure switched antenna from the plurality of metastructure switched antennas and determines a direction for transmission of a beam from the selected metastructure switched antenna.

An integrated fan-out (InFO) package includes a plurality of dies, an encapsulant, an insulating layer, a redistribution structure, a plurality of conductive structures, an antenna confinement structure, and a slot antenna. The encapsulant laterally encapsulates the dies. The insulating layer is disposed over the dies and the encapsulant. The redistribution structure is sandwiched between the insulating layer and the dies. The conductive structures and the antenna confinement structure are embedded in the insulating layer. The slot antenna is disposed on the insulating layer.

An antenna assembly and an electronic device are provided according to the present disclosure. The antenna assembly includes an antenna module and a bandwidth matching layer. The antenna module is configured to transmit and receive, within a preset direction range, a millimeter wave signal in a target frequency band. The bandwidth matching layer is spaced apart from the antenna module, and at least part of the bandwidth matching layer is disposed within the preset direction range. The bandwidth matching layer is configured to match an impedance of the antenna module to an impedance of free space to enable an impedance bandwidth of the antenna module in the target frequency band when the bandwidth matching layer is provided to be greater than an impedance bandwidth of the antenna module in the free space.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T.sub.2) of 5 nm or more and 100 nm or less.

An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

A dual-polarized antenna is presented for 5G mobile communications. The antenna includes two discrete elements—a folded dipole and a folded monopole, which generate two orthogonal polarizations. Parasitic elements are used to realize higher-band operation. In one example, the antenna covers both the 28 GHz band and the 39 GHz band. The entire structure is designed on an ultra-thin four-layer laminate and is intended to be incorporated along the edges of smartphones to enable 5G operation.