A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Systems and methods of manufacture are disclosed for semiconductor device assemblies having a front side metallurgy portion, a substrate layer adjacent to the front side metallurgy portion, a plurality of through-silicon-vias (TSVs) in the substrate layer, metallic conductors located within at least a portion of the plurality of TSVs, and at least one conductive connection circuitry between the metallic conductors and the front side metallurgy portion. The plurality of TSVs with metallic conductors located within are configured to form an antenna structure. Selectively breakable connective circuitry is used to form and/or tune the antenna structure.

Included are: a first dielectric substrate provided with a first conductor ground plane on a front or back surface thereof; a plurality of patch antennas formed in the first conductor ground plane, a plurality of conductive members, ends of which connected to the first conductor ground plane to surround the patch antennas individually, and a second conductor ground plane connected to each of the other ends of the conductive members, and parts of the plurality of conductive members penetrate the first dielectric substrate, and the remaining parts of the conductive members function as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane.

A dual-polarized antenna is presented for 5G mobile communications. The antenna includes two discrete elements—a folded dipole and a folded monopole, which generate two orthogonal polarizations. Parasitic elements are used to realize higher-band operation. In one example, the antenna covers both the 28 GHz band and the 39 GHz band. The entire structure is designed on an ultra-thin four-layer laminate and is intended to be incorporated along the edges of smartphones to enable 5G operation.

Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.

An antenna system includes: a first antenna element configured to transduce between second wireless energy and second transmission-line-conducted energy, wherein the first and second wireless energy are of first and second polarizations of the first antenna element and in first and second directions that are different and define a first plane; and a second antenna element configured to transduce between third wireless energy and third transmission-line-conducted energy and between fourth wireless energy and fourth transmission-line-conducted energy, wherein the third and fourth wireless energy are of first and second polarizations of the second antenna element and in third and fourth directions that are different and define a second plane that is substantially orthogonal to the first plane.

A method of manufacturing an antenna for transmission or receipt of wireless power includes disposing a first antenna molecule on a first surface, the first surface comprising a dielectric material and disposing a second antenna molecule on a second surface. The method further includes positioning the first surface and the second surface such that the dielectric material is positioned between the first antenna molecule and the second antenna molecule and the first antenna molecule and the second antenna molecule partially overlap.

A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

An antenna array that can include a plurality of antenna cells positioned in a global coordinate system of the antenna array. Each of the plurality of antenna cells has a respective local coordinate system and can include a radiating element having a predetermined angle of rotation defined in the global coordinate system and an antenna port coupled to the radiating element, the antenna port being positioned at a particular set of coordinates in the respective local coordinate system. The particular set of coordinates of the antenna port of each of the plurality of antenna cells can be the same.

A circuit board for radar sensors including a substrate having a topside and a lower surface. The circuit board has at least one antenna device, which is situated on the topside of the substrate and is developed out of a metal layer. In addition, the circuit board has a fill structure situated on the topside of the substrate, which is developed out of the metal layer. The fill structure is situated at a distance from the antenna device in a surface region of the topside of the substrate, the surface region not being taken up by the antenna device. The fill structure has no electrical connection to the antenna device. The surface utilization of the fill structure amounts to between 50% and 300% of that of a surface utilization of the antenna device.