The present disclosure provides an antenna package structure and packaging method. The package structure includes: a metal joint pin fabricated by using a wire bonding process; and a packaging layer, covering the metal joint pin. An antenna circuit chip and an antenna metal layer are electrically connected to two ends of the antenna feeder package structure.

A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.

Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

An antenna array that can include a plurality of antenna cells positioned in a global coordinate system of the antenna array. Each of the plurality of antenna cells has a respective local coordinate system and can include a radiating element having a predetermined angle of rotation defined in the global coordinate system and an antenna port coupled to the radiating element, the antenna port being positioned at a particular set of coordinates in the respective local coordinate system. The particular set of coordinates of the antenna port of each of the plurality of antenna cells can be the same.

The present application provides flexible radio frequency (RF) assemblies, components thereof and related methods. The present application includes at least one flexible substrate comprising first and second sides, a flexible framework portion comprising a first material composition and a plurality of discrete spaced interior portions comprising second material compositions that differ from that of the flexible framework portion. The framework portion extends fully about a portion of each interior portion. The framework portion comprises a flexibility that is greater than that of the interior portions. Each interior portion and the framework portion comprise a dielectric constant, a loss tangent, a volume resistivity, a surface resistivity and a magnetic relative permeability. At least one of the dielectric constant, the loss tangent, the volume resistivity, the surface resistivity and the magnetic relative permeability of at least one of the interior portions differs from that of the framework portion.

Examples disclosed herein relate to a multi-layer, multi-steering (“MLMS”) antenna array for millimeter wavelength applications. The MLMS antenna array includes a superelement antenna array layer comprising a plurality of superelement subarrays, in which each superelement subarray of the plurality of superelement subarrays includes a plurality of radiating slots for radiating a transmission signal. The MLMS antenna array also includes a power division layer configured to serve as a feed to the superelement antenna array layer, in which the power division layer includes a dielectric layer interposed between a plurality of conductive layers. The MLMS antenna array also includes a top layer disposed on the superelement antenna array layer. The top layer may include a superstrate or a metamaterial antenna array. Other examples disclosed herein include a radar system for use in an autonomous driving vehicle.

An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Disclosed is an array antenna comprising a plurality of array elements. The plurality of array elements are formed as a coupler including a central element and peripheral elements configured to surround the central element; each of the central element and the peripheral elements is formed as a waveguide; and the peripheral elements are excited in higher-order modes using coupling slots to form a beam pattern through an electric field distribution of the central element and the peripheral elements.

A connected dielectric resonator antenna array (connected-DRA array) operational at an operating frequency and associated wavelength, includes: a plurality of dielectric resonator antennas (DRAs), each of the plurality of DRAs having at least one volume of non-gaseous dielectric material; wherein each of the plurality of DRAs is physically connected to at least one other of the plurality of DRAs via a relatively thin connecting structure, each connecting structure being relatively thin as compared to an overall outside dimension of one of the plurality of DRAs, each connecting structure having a cross sectional overall height that is less than an overall height of a respective connected DRA and being formed from at least one of the at least one volume of non-gaseous dielectric material, each connecting structure and the associated volume of the at least one volume of non-gaseous dielectric material forming a single monolithic portion of the connected-DRA array.

Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.