A structure including a first wafer, including first active components configured so as to introduce a phase shift; a first metal layer, formed on a first surface of the first wafer; a first interconnect structure, formed on a second surface of the first wafer, including first bias lines; a set of first planar antennas, formed on the first interconnect structure; a second wafer; a second metal layer, formed on a first surface of the second wafer; a set of second planar antennas, formed on a second surface of the second wafer; the first and second wafers being joined by way of the first and second metal layers such that the first and second planar antennas are aligned, the first and second metal layers forming a ground plane.

An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.

A radio frequency (RF) system including first and second planar RF devices coupled by non-galvanic interconnect. According to various embodiments, a first RF device and a second RF device are separated by a dielectric layer, each of the first and second RF devices including a plurality of pads disposed on surface and surrounded by a common electrode, the common electrode configured as a grounded metal shield, wherein pads of the first RF device and pads of the second RF device face each other to provide capacitive coupling between the pads. The disclosure may reduce complexity and size of the system, and offer more reliable and easily producible interconnection between elements of the RF system.

A circuit board for radar sensors including a substrate having a topside and a lower surface. The circuit board has at least one antenna device, which is situated on the topside of the substrate and is developed out of a metal layer. In addition, the circuit board has a fill structure situated on the topside of the substrate, which is developed out of the metal layer. The fill structure is situated at a distance from the antenna device in a surface region of the topside of the substrate, the surface region not being taken up by the antenna device. The fill structure has no electrical connection to the antenna device. The surface utilization of the fill structure amounts to between 50% and 300% of that of a surface utilization of the antenna device.

A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.

The disclosure relates to a waveguide system comprising a plurality of stacked layers. The system further comprises a waveguide in a direction across the layers by providing each layer with a predetermined metal pattern. The disclosure further relates to a method for forming a waveguide.

An antenna assembly and an antenna device including the same are provided. The antenna assembly includes antenna elements, a first printed circuit board (PCB), cavity filters, and a second PCB. The first PCB has one surface provided with the antenna elements. The cavity filters are installed on the other surface of the first PCB and electrically connected to the plurality of antenna elements. The second PCB has one surface electrically connected to the cavity filters and includes at least a power amplifier, digital processing circuit, and calibration network. The second PCB includes one or more first processing areas and one or more second processing areas extending in parallel with each other. The digital processing circuit is disposed in the second processing area and not in the first processing area. The power amplifier is disposed in the first processing area and not in the second processing area.

Systems and methods of manufacture are disclosed for semiconductor device assemblies having a front side metallurgy portion, a substrate layer adjacent to the front side metallurgy portion, a plurality of through-silicon-vias (TSVs) in the substrate layer, metallic conductors located within at least a portion of the plurality of TSVs, and at least one conductive connection circuitry between the metallic conductors and the front side metallurgy portion. The plurality of TSVs with metallic conductors located within are configured to form an antenna structure. Selectively breakable connective circuitry is used to form and/or tune the antenna structure.

Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.

An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.