An electrical connector includes an insulative housing and a number of terminals retained in the insulative housing. The insulative housing has a mating surface, a mounting surface, and a slot going through the mounting surface. The terminal received in the slot includes an interference portion retained in the slot, a contacting portion disposed around the mating surface, and a soldering leg extending downwardly beyond the mounting surface. The interference portion has two barbs disposed at two opposite sides thereof, respectively. The terminal includes a blocking portion connecting between the interference portion and the soldering leg. The width of the blocking portion is greater than the width of the interference portion.

Provided is a soldering method for soldering a tip end of an electric wire to a soldering portion of a metallic terminal which allows the soldering to be performed with excellent workability. The method includes a damming structure forming step forming a damming structure at a periphery of the soldering portion to dam a solder which is supplied in a molten state with a flux to the soldering portion to keep the solder at the soldering portion, an electric wire setting step setting the tip end of the electric wire at the soldering portion ready for soldering, and a solder supplying step supplying the solder in the molten state with the flux to the soldering portion to perform the soldering.

According to one embodiment, a connector includes an insulator and a contact terminal in which an end side is pressed into a counter-press-fit portion of the insulator, and the other end side comprises a soldered portion attached to a substrate with soldering. The contact terminal comprises a flux accumulation portion inside the counter-press-fit portion and/or in an extended end portion of the soldered portion.

Provided is a pin header (100). The pin header (100) comprises an insulation body (10) and a plurality of pins (30) arranged at intervals. A portion of each pin (30) is fixed to the insulation body (10). Each pin (30) comprises a wire connection portion (31). A welding platform (11) is formed at a surface of the insulation body (10). A plurality of wire connection portions (31) are fixed to a platform surface (111) of the welding platform (11). The pin header (100) aims to realize mechanical automation of a welding operation between a wire and a wire connection portion (31) thereof, thereby improving productivity, and reducing labor costs.

An imaging module of the invention includes: a solid-state image sensing device including an imaging-device terminal; a connector having a first end face, a second end face located opposite to the first end face, and a side face orthogonal to the first end face, the connector including: a main body serving as an insulating member, an implanted conductor that is implanted in an inside of the main body, a first mounting terminal that is electrically connected to the imaging-device terminal and the implanted conductor and is provided on the first end face, a second mounting terminal that is provided on the side face and constitutes part of the implanted conductor, and a third mounting terminal that is provided on the second end face and constitutes part of the implanted conductor; and a signal cable electrically connected to the second mounting terminal.

Coaxial connector including a center conductor provided inside an outer conductor with a tubular outer conductor main body. A mating portion on one side in the axial direction of the outer conductor main body detachably mates with a counterpart connector. A supporting portion on the other side in the axial direction of the outer conductor main body supports the center conductor through the insulating member medium. Securing portions projecting from the end face on the other side in the axial direction or from the outer peripheral surface on the other side in the axial direction of the outer conductor main body towards the other side in the axial direction securing the outer conductor by soldering to a conductor pattern on the board surface. A first barrier portion on the outer peripheral surface on the other side in the axial direction of the outer conductor main body blocks solder flow.

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways each extending through the housing and having an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on the first surface of the housing that is electrically continuous with the conductive material of the inner wall surface. Each of the contacts includes a contact portion positioned above the first surface of the housing and configured to be elastically deformed by a contact pad electrically connected with the contact, an insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway, and a joint portion joined to the conductive pad.

A socket comprises a housing made of an insulating board and a plurality of contacts arranged on a first surface of the housing. The housing has a plurality of passageways. Each passageway extends through the housing and has an inner wall surface plated with a conductive material. The housing also has a conductive pad formed on a second surface of the housing so as to correspond to one of the passageways. The conductive pad is electrically continuous with the conductive material of the inner wall surface of the passageway and extends from the passageway. The housing also has a solder ball attached to the conductive pad. Each of the contacts corresponds to one of the plurality of passageways and is electrically connected to both the conductive material of the inner wall surface of the passageway and a contact pad of an electronic component.

An electrical contact for forming a materially bonded, electrically conductive connection to a mating contact comprises a contact surface and a soldering body. The contact surface has a recess extending into the contact surface. The soldering body is formed of a hard solder material and is pressed into the recess. The soldering body protrudes out from the recess beyond the contact surface.