Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).

Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).

According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

A socket electrically connects a first electric component and a second electric component, including: a base part in which a through hole extending through the base part from a top surface to a bottom surface in a vertical direction is formed; a contact pin inserted to the through hole such that a pin lower end is exposed from the bottom surface, and configured such that, when in use, a pin upper end makes contact with the first electric component; and a sheet member including a through electrode extending therethrough in the vertical direction, disposed at the base part in a state where the sheet member faces the bottom surface, and configured such that, when in use, an upper end of the through electrode makes contact with the pin lower end and a lower end of the through electrode makes contact with the second electric component.

A method for providing a removable quick-connect between a junction box and an electrical fixture is provided. A first junction box mounting plate is removably affixed to the junction box, and a first electrical connector is positioned in a channel in a front face of the first junction box mounting plate. A second electrical fixture mounting plate is removably affixed to the electrical fixture, and a second electrical connector is positioned in a slot in a projection extending upwardly from a front face of the second fixture mounting plate. The channel in the front face of the first junction box mounting plate is aligned with the projection extending from the front face of the second electrical fixture mounting plate. The channel includes angled side walls and the projection includes side walls angled in the opposite direction. The projection is then slid into the channel until the first electrical connector engages the second electrical connector.

It is aimed to enable a plurality of housings to be stacked without enlarging a connector. A connector includes a housing (60) including a lock receiving portion (67) inside and a case (10) internally provided with accommodation areas (13) capable of accommodating a plurality of the housings (60) in parallel and including lock portions (21) on back surfaces (18) of the accommodation areas (13), and the lock portions (21) resiliently lock the lock receiving portions (67) of the respective housings (60) to restrict the separation of the housings (60) from the accommodation areas (13).

A plurality of signal terminals are disposed in parallel and comprise an embedded part embedded and held in a base member of insulating material and a protruding part that protrudes from the base member, the protruding part forms a connecting part that is electrically connected by contacting or solder-connecting to a mating connecting body, the base member comprises a main body holding part that covers the entire circumference of the circumferential surface of the signal terminals and holds the signal terminals, and a semi-exposed holding part that exposes a portion of the circumferential surface of the signal terminals while covering and holding the remaining portion, with the protruding part of the signal terminals protruding from the semi-exposed holding part with regard to the main body holding part.

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

A coaxial tap in a hybrid fiber coaxial cable distribution system serves subscribers with an RF signal.