A connector of an electrical connection assembly includes terminals (20) corresponding respectively to wires (10) arranged in a wire arrangement direction, an insulating housing and connecting members (70) applied to the terminals (20). Each terminal (20) has a wire connection surface (27a). The connecting member (70) is made of solder and is fixed to the wire connection surface (27a) to electrically connect a conductor (12) of the wire (10) and the wire connection surface (27a). A surface of the connecting member (70) has a convex-concave shape including restricting portions (73, 74) for restricting displacement of the wire (10) with respect to the wire connection surface (27a) in the wire arrangement direction, thereby ensuring high connection reliability by stabilizing relative positions of the wires and terminals in the connector.

An electrical connector includes: an insulating body, provided with multiple accommodating holes; multiple terminals, respectively accommodated in the accommodating holes, where each of the terminals is provided with a clamping portion; and multiple solder posts, each being clamped by the clamping portion of one of the terminals. A height of each solder post is greater than a maximum width of each solder post. Each solder post is formed by a first base and a second base connected with each other. The clamping portion clamps the first base. The second base is located outside the clamping portion. A height of the first base and a height of the second base are both greater than one half of the maximum width of each solder post. The height of the second base is greater than 0.15 mm.

Systems and methods for soldering a workpiece using a solder application system. A nozzle includes a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder. The plurality of walls also define a soldering region that is external to the nozzle reservoir. The plurality of walls in the soldering region define holes that are configured to dispense the liquid solder from the nozzle reservoir. The holes are configured such that the liquid solder dispensed therefrom merges into a combined stream and the workpiece is soldered when placed into the combined stream

A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Provided is a manufacturing method for an aluminum coaxial cable provided with a coaxial connector, which includes a coaxial cable including an inner conductor having a predetermined length, an insulating portion covering the outside of the inner conductor in a longitudinal direction of the inner conductor, an outer conductor covering the outside of the insulating portion in the longitudinal direction of the inner conductor, a jacket portion covering the outside of the outer conductor in the longitudinal direction of the inner conductor, and a connection pin provided with an insertion groove to which the end of the inner conductor is inserted; and a coaxial connector including a connector main portion which has the other side opened so that the outer conductor end is inserted and has an installation groove in which the inner portion is hollow, and a clamp portion provided outside the connector main portion. The manufacturing method for an aluminum coaxial cable provided with a coaxial connector includes: removing the jacket portion to a first predetermined length so that the outer conductor is exposed to the outside; removing the outer conductor and the insulating portion to a second predetermined length so that the inner conductor is exposed to the outside while the outer conductor is exposed to a third predetermined length; applying a flux to the exposed inner conductor end; pre-fixing the inner conductor end applied with the flux which is inserted to the insertion hole of the connection pin after injecting a predetermined amount of lead to the insertion hole of the connection pin; and coupling the inner conductor and the connection pin by supplying a high frequency to a portion where the inner conductor and the connection pin are coupled to each other.

A circuit structure disclosed in the present specification includes: a circuit board provided with a wiring portion; a conductor body (conductor plate) adhered to one side of the circuit board; and a terminal that electrically connects the wiring portion of the circuit board and the conductor body. The terminal includes a relay connection portion between a portion connected to the wiring portion and a portion connected to the conductor body, and the relay connection portion protrudes past the wiring portion, on the other side of the circuit board.

A method includes attaching a micro-coaxial wire to electrical contacts in a substrate, the micro-coaxial wire including a core wire, a bonded section, and a shield layer, the electrical contacts including a first electrical contact and a second electrical contact. Attaching the micro-coaxial wire to the electrical contacts includes connecting a core wire of the micro-coaxial wire to the first electrical contact including forming a bonded section by bonding the core wire to the first electrical contact, and then depositing solder onto the bonded section of the core wire.

A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90.

A terminal (20) includes a bottom surface (23) and solder holding portions (25, 25). A solder member (30) is placed on the bottom surface (23) of the terminal (20) and the solder holding portions (25, 25) are deformed to hold the solder member (30) in place. A conductor (12) of a wire (11) is placed on solder member (30). The solder member (30) then is melted by heating to connect the conductor (12) of the wire (11) to the terminal (20).

A pane having an electrical connection element, the pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and a soldering region connected-to the electrically conductive structure by means of a lead-free solder.