An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.

In one embodiment, the semiconductor laser comprises a housing in which multiple laser diode chips are encapsulated. The housing comprises a cover panel and/or a lateral wall which is permeable to the generated laser radiation. The cover panel and/or the lateral wall has a light outlet surface with adjacent outlet regions. Each of the outlet regions is paired with precisely one of the laser diode chips. The light outlet surface is arranged downstream of a light outlet plane. The cover panel and/or the lateral wall has a different average thickness in the outlet regions such that the optical wavelength for the laser radiation of all of the laser diode chips is the same up to the light outlet plane with a tolerance of maximally 1.5 μm.

The disclosure relates to multifunctional sensors for mobile applications, namely to a miniature optical sensor for remote micro- and macro-object detection and characterization. The disclosure makes it possible to reduce the size of the sensor, this provides for surface mount of the sensor in any microcircuit of a mobile device. The sensor is multifunctional, low-power, vibration-resistant. The sensor comprises at least one pair consisting of a radiation source and a corresponding radiation receiver, an optical circuit including a collimating element, a first optical element, a second optical element. The first optical element and the second optical element are interconnected by a common surface, the common surface being a semitransparent surface. The sensor may be used simultaneously as a microphone, a dust sensor, a lidar, and a photoplethysmogram (PPG) sensor.

In one embodiment, a package includes: a substrate; a photonic integrated circuit (PIC) adapted to the substrate, the PIC including at least one optical circuit, a first plurality of waveguides, a second plurality of waveguides, and a laser to output optical energy via the first plurality of waveguides; and a prism assembly adapted to the substrate to reflect the optical energy output from the first plurality of waveguides to the second plurality of waveguides, the prism assembly including a prism and at least one isolator. Other embodiments are described and claimed.

The upper surface of the semiconductor substrate has a slope descending from the projection in the second direction at an angle of 0-12° to a horizontal plane. The mesa stripe structure has an inclined surface with a slope ascending from the upper surface of the semiconductor substrate at an angle of 45-55° to the horizontal plane, the mesa stripe structure having an upright surface rising from the inclined surface at an angle of 85-95° to the horizontal plane. The buried layer is made from semiconductor with ruthenium doped therein and is in contact with the inclined surface and the upright surface. The inclined surface is as high as 80% or less of height from the upper surface of the semiconductor substrate to a lower surface of the quantum well layer and is as high as 0.3 μm or more.

A compact diode laser achieves high-power, short duration output pulses by separating the lasing action from the pulse-generating mechanism. A diode seed source is configured for gain-switching via a variable RF source. A time lens element includes an intensity modulation device, a phase modulation device, and a pulse compressor. The intensity modulation device carves shorter pulses from the long gain-switched seed pulses, the phase modulation device adds chirp, and the pulse compressor compensates for the chirp while producing high-power short-duration output pulses.

A light detection and ranging (LIDAR) device includes a laser assembly tier and a photonic integrated circuit (PIC) tier. The laser assembly tier includes a laser configured to emit laser light. The PIC tier includes a semiconductor optical amplifier (SOA) and a PIC wafer configured to incouple laser light into the PIC wafer and direct the laser light to the SOA.

Methods and systems for a light source arrangement supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The arrangement may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source arrangement to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source arrangement may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.