A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

Provided here are: a mounting section having a light-emitting element for emitting an optical signal; a mounting section arranged alongside the mounting section and having a light-emitting element for emitting an optical signal that is different in wavelength from the optical signal; and an optical multiplexer having a filter for transmitting therethrough only the wavelength of the optical signal, a mirror for reflecting the optical signal transmitted through the filter, and a filter arranged alongside the filter, for transmitting therethrough only the wavelength of the optical signal, and for reflecting the optical signal reflected by the mirror and multiplexing it with the transmitted optical signal; wherein the light-emitting element is mounted in the mounting section to be displaced toward the light-emitting element from a center in a width direction across an emission direction of the optical signal.

A light source module, which includes a heat sink, a laser assembly, a circuit board assembly, a conductive material, and multiple lock members, is provided. The circuit board assembly includes a circuit board, which has an accommodating opening that corresponds to a beam emitter of the laser assembly. The lock members respectively pass through third lock holes of the circuit board assembly, second lock holes of the laser assembly, and first lock holes of the heat sink in sequence, thereby locking the circuit board assembly and the laser assembly on the heat sink. The accommodating opening of the circuit board exposes the beam emitter, and the conductive material connects two conductive pads of the laser assembly to two corresponding electroplated through holes, thereby enabling the laser assembly to be electrically connected to the circuit board assembly. A projector including the light source module is also provided.

A light source module, which includes a heat sink, a laser assembly, a circuit board assembly, a conductive material, and multiple lock members, is provided. The circuit board assembly includes a circuit board, which has an accommodating opening that corresponds to a beam emitter of the laser assembly. The lock members respectively pass through third lock holes of the circuit board assembly, second lock holes of the laser assembly, and first lock holes of the heat sink in sequence, thereby locking the circuit board assembly and the laser assembly on the heat sink. The accommodating opening of the circuit board exposes the beam emitter, and the conductive material connects two conductive pads of the laser assembly to two corresponding electroplated through holes, thereby enabling the laser assembly to be electrically connected to the circuit board assembly. A projector including the light source module is also provided.

An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.

A lead pin (2a,2b) penetrates a metal stem (1). A support block (3) is mounted on the metal stem (1). A dielectric substrate (4) is mounted on a side surface of the support block (3). A signal line (5a,5b) is formed on the dielectric substrate (4). One end of the signal line (5a,5b) is connected to the lead pin (2a,2b). A semiconductor optical modulation device (6) is mounted on the dielectric substrate (4). A conductive wire (8a,8b) connects the other end of the signal line (5a,5b) and the semiconductor optical modulation device (6). The semiconductor optical modulation device (6) includes a plurality of optical modulators (6b,6c) separated from each other.

First block (10) and second block (20) are placed on top of each other with insulation sheet (45) interposed therebetween. First adherend surface (12) and second adherend surface (22) are provided on a facing surface of first block (10) and a facing surface of second block (20), respectively. Adhesive (50) is applied to first adherend surface (12) and second adherend surface (22). First block (10) and second block (20) are bonded to each other with adhesive (50).

A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.

An optical element mounting module includes a wiring board including an upper surface and a terminal, an optical waveguide on the upper surface and the terminal, and an optical element on the optical waveguide, including a light emitting/receiving portion having a convex shape and an electrode. The optical waveguide includes a lower cladding layer, a core on the lower cladding layer, an upper cladding layer, a cavity between the upper surface of the upper cladding layer to the lower cladding layer for dividing the core, a through hole passing through the upper to the lower cladding layer to the terminal, and a conductive material in the through hole and connected to the electrode and the terminal. The light emitting/receiving portion includes a first part on the upper cladding layer and a second part between the upper surface of the upper cladding layer and the lower surface of the optical element.