In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.

An optical transceiver supports bidirectional communication with another optical transceiver that is a communications partner via a single-mode optical fiber. A surface emitting laser has a T-band oscillation wavelength that is shorter than the cutoff wavelength of the optical fiber. A photodetector has detection sensitivity with respect to the T band. A planar lightwave circuit couples the optical fiber, the surface emitting laser, and the photodetector

An optical module includes a light-forming unit to form light. The light-forming unit includes a base member having an electronic temperature control module, a base plate, a plurality of submounts, and a microelectromechanical system (MEMS) base.

The light-forming unit also includes a plurality of laser diodes arranged on the submounts, a filter arranged on the base plate and located to receive the light emitted from the plurality of laser diodes and multiplex the emitted light, a MEMS arranged on the MEMS base and located to receive the light multiplexed by the filter. The MEMS includes a scanning mirror to scan the light multiplexed by the filter, and the electronic temperature control module regulates a temperature range of the MEMS. The light-forming unit also includes a protective member surrounding and sealing the light-forming unit, which includes a base body and a lid welded to the base body.

Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.

Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.

Embodiments of the present disclosure include optical transmitters and transceivers with improved reliability. In some embodiments, the optical transmitters are used in network devices, such as in conjunction with a network switch. In one embodiment, lasers are operated at low power to improve reliability and power consumption. The output of the laser may be modulated by a non-direct modulator and received by integrated optical components, such as a modulator and/or multiplexer. The output of the optical components may be amplified by a semiconductor optical amplifier (SOA). Various advantageous configurations of lasers, optical components, and SOAs are disclosed. In some embodiments, SOAs are configured as part of a pluggable optical communication module, for example.

An electronic device according to various embodiments may comprise: a circuit board; a plurality of light sources mounted on the circuit board; a first detection circuit arranged adjacent to the plurality of light sources and mounted on the circuit board; and a casing including a body portion mounted on the circuit board and surrounding at least a portion of an area in which the plurality of light sources and the first detection circuit are arranged, and a window mounted on the body portion facing the plurality of light sources, wherein the window may include a diffuser formed on at least one surface of the window and configured to disperse light emitted from the plurality of light sources and a second detection circuit at least partially surrounding the diffuser on the outer surface of the window.

An opto-electronic device includes a semiconductor substrate having a planar surface. An emitter is formed on the substrate and configured to emit a beam of light away from the planar surface. A reflective layer is formed on the planar surface adjacent to the emitter. A transparent layer is formed over the planar surface and has a curved outer surface including a first segment positioned vertically over the emitter and configured to internally reflect the emitted beam of light toward the reflective layer, and a second segment positioned and configured to collimate and transmit the beam reflected from the reflective layer.

The optical module includes an extension circuit board and a front end flip-chip mounted on the extension circuit board. The front end includes a semiconductor amplifier chip that executes signal processing, and an optical semiconductor chip that includes at least one of a light emitting element and a light receiving element and is flip-chip mounted on the semiconductor amplifier chip. The extension circuit board has a recessed portion that can accommodate at least a part of the optical semiconductor chip. The semiconductor amplifier chip is flip-chip mounted on the extension circuit board in the state where the surface mounting the optical semiconductor chip faces the surface of the extension circuit board, and at least a part of the optical semiconductor chip is accommodated in the recessed portion.

A light-source apparatus includes a light-source chip, a case, first and second electrically-conductive parts, a substrate, an electromagnetic shield plate, an electrically-conductive layer and an electrically-conductive unit. The light-source chip is received in the case. Each of the first and second electrically-conductive parts is a part of the case. The case is mounted to the substrate. The electromagnetic shield plate covers at least part of the substrate. The electrically-conductive layer is formed on the substrate and electrically connected with both the second electrically-conductive part and the electromagnetic shield plate. The electrically-conductive unit is provided to electrically connect the first electrically-conductive part and the electromagnetic shield plate.