An airport runway approach lighting apparatus is disclosed. According to one embodiment. the airport runway approach light includes a visible light source configured to emit a visible light brain and an infrared light source configured to emit an infrared beam. A first lens is attached to the visible light source to change the visible light beam emitted from the visible light source to a desired visible light beam pattern. The infrared light source includes a plurality of semiconductor laser diodes distributed on a surface of a laser diode chip in an array.

A TO-type optical element package for high-speed communication which is used for an optical module for high-speed communication of at least 10 gigabits per sec (Gbps) and enables thermoelectric elements to be embedded in an upper part of a stem. The TO-type optical element package for high-speed communication can transmit high-quality signals in a high-speed operation of the optical element by inserting and fixing an electrode pin (120) in a through-hole formed on a stem base (100), surrounding a lateral surface of the electrode pin (120) protruding to an upper part of the stem base (100), with a metallic instrument (400) having a through-hole so as to enable the impedance of an electrode pin (120) part, surrounded with the stem base (100), to correspond to the impedance of an electrode pin (120) part protruding to the upper part of the stem base (100).

An irradiation system includes: a first beam source configured to output a first laser beam and a second beam source configured to output a second laser beam, in which the second laser beam has a higher beam quality higher than that of the first laser beam;

optics arranged to focus the first and second laser beams; and a beam guiding system including a first beam path along which the first laser beam is guided, and a second beam path along which the second laser beam is guided, in which the beam guiding system includes a beam combiner to superimpose the first and second laser beams, the first beam source is a pump laser, the second beam source is a laser resonator, and the beam guiding system further includes a beam switch adapted to feed the first laser beam into a pump laser beam path and/or into the first beam path.

A die bonding apparatus includes: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid. The lid contains a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.

A two-dimensional VCSEL array may include a VCSEL array including a VCSELs arranged in a two dimensional matrix forming a monolithic structure, a light-emitting surface, and a rear surface, first metal contacts provided on the light-emitting surface; and second metal contacts provided on the rear surface. The VCSELs may be arranged in first lines in a first direction and second lines in a second direction non-parallel to the first direction. Each of the first metal contacts may be electrically connected to each VCSEL of a corresponding first line. Each of the plurality of second metal contacts may be electrically connected to each VCSEL of a corresponding second line. The first metal contacts and second metal contacts may be arranged such that each combination of a first metal contact and a second metal contact is electrically connected to one VSCEL.

In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount. The device further comprising a housing coupled to the LSLD assembly, the housing comprising a carrier structure having an aperture configured to support the LSLD assembly on a first side and having a plurality of channels on a second side, a bottom segment configured to couple to the carrier segment to create an enclosure around the channels between a top side of the bottom segment and the second side of the carrier structure, an inlet and outlet formed in the housing for transporting a coolant into and out of the channels in the enclosure, wherein the members are disposed within the enclosure so as to expose the members to the coolant.

An assembly includes a carrier and a structure having a core formed on the carrier, wherein the core has a longitudinal extension having two end regions, a first end region is arranged facing the carrier and a second end region is arranged facing away from the carrier, the core is formed as electrically conductive at least in an outer region, the region is at least partially covered with an active zone layer, the active zone layer generates electromagnetic radiation, a mirror layer is provided at least in one end region of the core to reflect electromagnetic radiation in a direction, a first electrical contact layer contacts an electrically conductive region of the core, and a second contact layer contacts the active zone layer.

An optical crystal can be mounted to a mounting block configured to receive the crystal. A base portion on the mounting block utilizes two walls forming a corner and a single biasing spring clip to secure the crystal. The spring clip applies forces in two different directions substantially orthogonal to the two walls. The spring clip is based off a symmetrical geometry which applies nearly the same force application in both directions. The spring also features bend regions that contact the crystal in such a way as to reduce the presence of point loads or stress risers. The length of contact along the crystal is maximized, allowing for proper force distribution and a sufficient surface are contact for static holding capabilities.

In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.