Aspects described herein include a method of fabricating an optical component. The method comprises electrically coupling different laser channels of a laser die to different electrical leads, testing a respective optical coupling of each of the different laser channels, optically aligning an optical fiber with a first laser channel of the different laser channels having the greatest optical coupling, and designating a second laser channel of the different laser channels as a heater element for the first laser channel.

The present invention relates to an assembly of a temperature regulating device for a semiconductor laser.

The essence of the present invention is that a flat thermally conductive surface of said device is used as a thermally conductive base surface, the assembly further contains two fixing plates which are rigidly fastened to said thermally conductive base surface and adjoin the opposite lateral sides of a lower thermally insulated surface of a thermoelectric element, said surface being in contact with the thermally conductive base surface to prevent the longitudinal and transverse displacements of the thermoelectric element along the thermally conductive base surface, and a thermally conductive plate is rigidly fastened to the thermally conductive base surface and is thermally insulated therefrom.

A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion along a width direction of a semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the first portion has a first inclined surface inclined with respect to the side surface to go away from the side surface as going away from the semiconductor substrate, and a second inclined surface located opposite to the semiconductor substrate with respect to the first inclined surface and inclined with respect to a center line to approach the center line as going away from the semiconductor substrate. The metal layer extends over the first inclined surface and the second inclined surface.

A method is disclosed for mounting and cooling a circuit component having aplurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive and electrically insulating material with a circuit board arranged between the circuit component and the substrate. The circuit board, which has a flexible base and carries conductive traces that terminate in contact pads, is secured to the rigid substrate with at least some of the contact pads on the circuit board disposed on the side of the circuit board facing the rigid substrate, at least some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the flexible base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate. The side of the contact pads exposed by the holes is plated to form conductive vias that fill the holes and that are soldered to the contacts of the circuit component.

A micromechanical optical component having a substrate, a spacer, and a cover, which are positioned one above the other and delimit a hermetically sealed cavity. A semiconductor laser is situated in the cavity, on the substrate. An optical element, which is attached to the spacer, is positioned in a beam path of the semiconductor laser. A method for manufacturing a micromechanical optical component is also described.

A laser diode drive system configured to output a drive signal to control a voltage provided to a laser diode can include a circuit sensor system configured to output a sensed signal indicative of a drive current of a laser diode, and a temperature sensor configured to output a temperature signal indicative of a temperature of the laser diode or an ambient temperature of the laser diode. The system can include a temperature compensation system configured to output a correction signal based on the temperature signal to compensate for a temperature dependent factor in the sensed signal.

A laser source assembly is based upon an optical reference substrate that is utilized as a common optical reference plane upon which both a fiber array and a laser diode array are disposed and positioned to provide alignment between the components. Passive optical components used to provide alignment between the laser diode array and the fiber array are also located on the optical reference substrate. A top surface of the reference substrate is patterned to include alignment fiducials and bond locations for the fiber array receiving block, laser diode array submount and passive optical components. The receiving block is configured to present the optical fibers at a height that facilitates alignment with the output beams from the laser diodes positioned on the silicon submount.

Provided is a spatial light modulator includes a substrate; a distributed Bragg reflector (DBR) layer provided on a surface of the substrate; a cavity layer provided on the DBR layer; a pixel layer provided on the cavity layer, the pixel layer including a plurality of pixels; and a heat blocking member provided between the plurality of pixels and configured to block heat transfer between the plurality of pixels, wherein each of the plurality of pixels includes a plurality of active meta-patterns.

Provided is a spatial light modulator includes a substrate; a distributed Bragg reflector (DBR) layer provided on a surface of the substrate; a cavity layer provided on the DBR layer; a pixel layer provided on the cavity layer, the pixel layer including a plurality of pixels; and a heat blocking member provided between the plurality of pixels and configured to block heat transfer between the plurality of pixels, wherein each of the plurality of pixels includes a plurality of active meta-patterns.

An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.