A semiconductor laser device includes: a first semiconductor layer of a first conductivity type; a light emitting layer formed above the first semiconductor layer; a second semiconductor layer of a second conductivity type formed above the light emitting layer; and an electrode formed above a ridge portion formed in the second semiconductor layer. The electrode is divided at positions at which an integrated value of light intensities of higher-order mode oscillation has a local maximum.

The invention relates to an edge emitting laser diode comprising a semiconductor layer stack whose growth direction defines a vertical direction, and wherein the semiconductor layer stack comprises an active layer and a waveguide layer. A thermal stress element is arranged in at least indirect contact with the semiconductor layer stack, the thermal stress element being configured to generate a thermally induced mechanical stress in the waveguide layer that counteracts the formation of a thermal lens.

A distributed feedback (DFB) laser array includes a substrate, a semiconductor stacked structure, a first electrode layer, and a second electrode layer. The semiconductor stacked structure is formed above a surface of the substrate and includes two light-emitting modules and a tunnel junction. Each light-emitting module of the two light-emitting modules includes an active layer, a first cladding layer, and a second cladding layer. The active layer is installed between the first cladding layer and the second cladding layer, and the active layer has multiple lasing spots along a first direction, wherein the multiple lasing spots are used for generating multiple lasers. The tunnel junction is installed between the two light-emitting modules. The first electrode layer is formed above the semiconductor stacked structure. The second electrode layer is formed above another surface of the substrate.

Disclosed in the present invention is a semiconductor laser, which includes one or more semiconductor chips (1-1), a total length of a gain region (1-11A) of a light-emitting unit (1-11) of each of the semiconductor chips (1-1) in a slow axis direction being 1 mm˜10 cm; a laser resonant cavity configured to adjust semiconductor laser emitted by the light-emitting unit (1-11) to resonate in the slow axis direction, so that the size of the gain region (1-11A) of the light-emitting unit (1-11) in the slow axis direction matches a fundamental mode spot radius ω.sub.0; and a fast-axis collimating element (FAC) disposed in the laser resonant cavity and configured to collimate the laser emitted by the light-emitting unit (1-11) in a fast axis direction. The semiconductor laser according to an embodiment of the present invention can improve the high-power output capability of the gain region on the one hand, and improve the beam quality on the other hand, which can achieve a high beam quality output of M.sup.2<2.

Disclosed are devices, methods, and systems for controlling output of a laser. An example device can comprise a first portion comprising a gain element and a second portion comprising a silicon material. The second portion can comprise a waveguide configured to receive light from the gain element, an optical resonator configured to at least partially reflect light back to the gain element via the waveguide, and a first tuning element configured to tune a resonant frequency of the optical resonator.

The present invention relates to a diode laser with an integrated thermal aperture. A laser diode (10) according to the invention comprises an active layer (14) formed between an n-doped semiconductor material (12) and a p-doped semiconductor material (16), wherein the active layer (14) forms an active zone (40) with a width w along a longitudinal axis for generating electromagnetic radiation; wherein in the p-doped semiconductor material (16) and/or in the n-doped semiconductor material (12) a thermal aperture (18) formed in a layer shape with a thermal conductivity coefficient k.sub.block smaller than a thermal conductivity coefficient k.sub.bulk of the corresponding semiconductor material (16, 12) is formed for a spatially selective heat transport from the active zone (40) to a side of the corresponding semiconductor material (16, 12) opposite to the active layer (14).

A QCL may include a substrate, an emitting facet, and semiconductor layers adjacent the substrate and defining an active region. The active region may have a longitudinal axis canted at an oblique angle to the emitting facet of the substrate. The QCL may include an optical grating being adjacent the active region and configured to emit one of a CW laser output or a pulsed laser output through the emitting facet of substrate.

The invention relates to an edge-emitting semiconductor laser comprising —at least two laser diodes, each of which is designed to generate electromagnetic radiation, wherein —the laser diodes are arranged on top of one another in a vertical direction, —the laser diodes are monolithically connected to one another, and —at least one frequency-stabilizing element is arranged in an end region of the laser diodes. The invention also relates to a method for producing an edge-emitting semiconductor laser.

The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

The invention relates to a component with a main part and a contact structure. The main part has an active zone which is designed to generate electromagnetic radiation at least in some regions during the operation of the component. The contact structure has a plurality of individually actuatable segments. The component has a connection surface and a lateral surface running transversely to the connection surface, and the lateral surface is designed as a radiation passage surface of the component. The connection surface is designed to be structured, wherein the connection surface is defined by common internal boundary surfaces between the main part and the contact structure, and each segment has a local common boundary surface with the main part and is designed for a pixelated current impression into the main part. The invention additionally relates to a method for operating such a component.