A light source module that emits a combined laser beam, and includes: a plurality of semiconductor laser elements; and a control circuit that controls power of a laser beam emitted by each of the semiconductor laser elements. The semiconductor laser elements include: a first element group that emits a first laser beam; and a second element group that emits a second laser beam. The combined laser beam includes at least one of the first laser beam or the second laser beam. The control circuit maintains an average combined-beam wavelength that is an average wavelength of the combined laser beam constant for a change in power of the combined laser beam. When the power of the first laser beam and the power of the second laser beam are equal to each other, an average wavelength of the first laser beam is longer than an average wavelength of the second laser beam.

An applicator comprising multiple laser assemblies connected to a power supply and a controller that switches each pulse to a different one of the laser assemblies. Each laser assembly deposits a laser spot on the skin and the result is to produce a large ‘aggregate’ spot without requiring extra power or extra lasers. In one embodiment, each pulse serves as a trigger to switch the next pulse to the next laser assembly.

A driver circuit includes: a current-controlling switching element electrically connected to a light emitting element; a differential amplifier circuit including: an output terminal electrically connected to the current-controlling switching element, a first input terminal configured to receive a reference signal as a reference for radiating light with a desired intensity from the light emitting element, and a second input terminal configured to receive a detection signal corresponding to a detection result of a current flowing in the light emitting element, wherein the differential amplifier circuit is configured to control the current flowing in the light emitting element and the current-controlling switching element based on a voltage of the first input terminal and a voltage of the second input terminal; and an adjustment part configured to adjust an overshoot amount of a rising edge of the current flowing in the light emitting element.

Methods, devices, and systems for double-sided cooling of laser diodes are provided. In one aspect, a laser diode assembly includes a first heat sink, a plurality of submounts spaced apart from one another on the first heat sink, a plurality of laser diodes, and a second heat sink on top sides of the plurality of laser diodes. Each laser diode includes a corresponding active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer. A bottom side of each laser diode is positioned on a different corresponding submount of the plurality of submounts. The plurality of laser diode are electrically connected in series.

Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.

An array type semiconductor laser device includes: a second electrode (p-electrode) disposed on another conductivity type semiconductor layer; a third electrode (n-electrode) disposed on a one conductivity type semiconductor layer and between a first electrode (p-electrode) and the second electrode; a fifth electrode (n-electrode) disposed on the one conductivity type semiconductor layer and between the third electrode and the second electrode; a sixth electrode (n-electrode) disposed on the one conductivity type semiconductor layer and across from the fifth electrode; a first conductor (wire) that electrically connects the second electrode and the third electrode; and a second conductor (n-wiring) that electrically connects the fifth electrode and the sixth electrode.

Implementing systems and methods for operating a LiDAR system. The methods comprise: supplying current from a laser diode bar driver of the LiDAR system to a light source of the LiDAR system; passing the current through a laser diode bar of the light source (the laser diode bar comprising a plurality of laser diodes electrically connected in series); emitting a light beam from the light source when current is passing through the plurality of laser diodes; and/or receiving light reflected off an object.

In various embodiments, laser systems or resonators incorporate two separate cooling loops that may be operated at different cooling temperatures. One cooling loop, which may be operated at a lower temperature, cools beam emitters. The other cooling loop, which may be operated at a higher temperature, cools other mechanical and/or optical components, for example optical elements such as lenses and/or reflectors.

A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.

A drive circuit that includes a switching circuit switching between a first state and a second state to cause a light-emitting element to perform pulse oscillation, and a direct current adjustment circuit. In the first state, light is emitted from a light-emitting element by supplying the light-emitting element with a current having a magnitude equal to or greater than a threshold current enabling the light-emitting element to emit light having an output equal to or greater than a predetermined output. In the second state, the magnitude of the current supplied to the light-emitting element is less than the threshold current. The direct current adjustment circuit supplies, to the light-emitting element, a bias current within a range less than the threshold current of the light-emitting element in the second state. The bias current has a magnitude corresponding to a magnitude of undershoot occurring at a falling edge of the pulse oscillation.