H02H5/044

Power conversion device and control circuit

A power conversion device may include: a microcomputer; and an output circuit controlled by the microcomputer, including an output unit that converts an input power into a predetermined power and outputs the predetermined power, an internal power source that supplies a power source to the microcomputer, a driver that drives the output unit by a signal from the microcomputer, and a microcomputer stop transition unit that, when an operation of the power conversion device is stopped, outputs a microcomputer stop signal to the microcomputer and causes an operation of the microcomputer to transition to a stop state. In one or more embodiments, after the microcomputer stop transition unit causes the operation of the microcomputer to transition to a stop state, the microcomputer or the output circuit may stop an output of the internal power source.

ELECTRONIC DEVICE AND TEMPERATURE DETECTION DEVICE THEREOF
20240113512 · 2024-04-04 · ·

An electronic device and a temperature detection device thereof are provided. The temperature detection device includes a differential stage circuit and an output stage circuit. The differential stage circuit includes a first differential end and a second differential end, and includes a cross-coupled transistor element, a first resistor and a second transistor. The cross-coupled transistor element receives a first voltage. The first resistor is coupled between the first differential end and a second voltage, and the first resistor is poly-silicon resistor. The second resistor is coupled between the second differential end and the second voltage, and the second resistor is a silicon carbide diffusion resistor. The output stage circuit generates a driving voltage according to a first control voltage on the first differential end and a second control voltage on the second differential end.

THERMAL PROTECTION OF SMPS SWITCH
20190334341 · 2019-10-31 ·

A circuit for measuring temperature of an external switch is disclosed. The circuit includes a variable resistor, a switch coupled to the variable resistor in series, a fixed value resistor coupled to the variable resistor and a comparator coupled between the variable resistor and the fixed value resistor. The circuit is configured to compare voltage drop between a drain and a source of the external switch when the external switch is in ON state with voltage drop at the variable resistor and output a signal to indicate an overtemperature based on the comparing.

POWER CONVERSION DEVICE AND CONTROL CIRCUIT

A power conversion device according to one or more embodiments may include: a microcomputer; and an output circuit controlled by the microcomputer, including an output unit that converts an input power into a predetermined power and outputs the predetermined power, an internal power source that supplies a power source to the microcomputer, a driver that drives the output unit by a signal from the microcomputer, and a microcomputer stop transition unit that, when an operation of the power conversion device is stopped, outputs a microcomputer stop signal to the microcomputer and causes an operation of the microcomputer to transition to a stop state. In one or more embodiments, after the microcomputer stop transition unit causes the operation of the microcomputer to transition to a stop state, the microcomputer or the output circuit may stop an output of the internal power source.

Ignition device
10424902 · 2019-09-24 · ·

An ignition device capable of more reliably protecting a primary winding of an ignition coil from high temperature is provided. The ignition device includes an ignition coil, a switching element, a temperature sensor, and a thermal cutout circuit. A primary winding of the ignition coil is connected to a DC power supply and the switching element. The temperature sensor is provided to measure the temperature of the switching element. The thermal cutout circuit forcibly turns off the switching element when the temperature of the switching element becomes higher than a predetermined forcible turn-off temperature Toff. The thermal cutout circuit is configured to lower the forcible turn-off temperature Toff when the power supply voltage Vb of the DC power supply decreases.

Semiconductor apparatus
10425074 · 2019-09-24 · ·

There has been a problem in semiconductor apparatuses of related art in which a circuit operation cannot be returned after a reverse current occurred. In one embodiment, a semiconductor apparatus includes a timer block configured to count up a count value to a predetermined value in response to a control signal being enabled, the control signal instructing a power MOS transistor to be turned on, and a protection transistor including a drain connected to a gate of the power MOS transistor, a source and a back gate connected to a source of the power MOS transistor, and an epitaxial layer in which the power MOS transistor is formed, the epitaxial layer being supplied with a power supply voltage. The protection transistor short-circuits the source and gate of the power MOS transistor in response to an output voltage of the power MOS transistor meeting a predetermined condition and the count value reaching the predetermined value. The timer block resets the count value when the output voltage of the power MOS transistor no longer meets the predetermined condition.

Power conversion device

Provided is a novel power conversion device that enables estimation of a temperature of a power device without using a temperature sensing diode and can accurately estimate a temperature and a current of a current sensing element that observes a main current. A measurement voltage (Vref) is applied between source terminals (31s and 49s) of a main control element 31 and a current sensing element 49 in a state in which the main control element 31 and the current sensing element 49 are turned off, and a temperature of a power device 30 is estimated from a current (Ib) flowing between the source terminals (31s and 49s) of the main control element 31 and the current sensing element 49 at the time of the application by using the fact that a resistance value of a semiconductor substrate between the source terminals of the main control element 31 and the current sensing element 49 has temperature dependency.

Device with power switch

A device comprises a solid-state power switch and a control configured to operate the power switch if at least one of a plurality of fault conditions of the device is triggered. An interface is configured to output a signal having a value selectively indicative of the triggered at least one fault condition in response to the at least one fault condition being triggered.

Overheat protection circuit, and semiconductor integrated circuit device and vehicle therewith
10366977 · 2019-07-30 · ·

An overheat protection circuit has an NPN transistor, a power terminal to which a supply voltage is applied, a transmission path by which the supply voltage is transmitted from the power terminal to the collector of the NPN transistor without passing through a current source, and an output voltage generator that generates an output voltage commensurate with the base-emitter voltage of the NPN transistor.

Temperature Sensing and Fault Detection for Paralleled Double-Side Cooled Power Modules
20190222018 · 2019-07-18 ·

In accordance with an embodiment, a method includes: monitoring a temperature difference between two double-side cooled (DSC) power modules of a plurality of DSC power modules arranged in stacks of DSC power modules; comparing the temperature difference with a first temperature threshold; detecting a cooling pipe system blockage when the temperature difference is above the first temperature threshold; and after detecting the cooling pipe system blockage, disabling gate driver circuits coupled to the plurality of DSC power modules or operating the DSC power modules in a low-power mode. Each stack includes a plurality of DSC power modules. Each DSC power module has a top surface and a bottom surface, which are each thermally coupled with one or more cooling channels of a cooling pipe system. The two DSC power modules are thermally coupled with a same cooling channel of the one or more cooling channels.