A clock integrated circuit is provided. The clock integrated circuit includes: a first clock generator which includes a crystal oscillator configured to generate a first clock signal; and a second clock generator which includes a resistance-capacitance (RC) oscillator and a first frequency divider, and is configured to: generate a second clock signal using the first frequency divider based on a clock signal output from the RC oscillator; perform a first calibration operation for adjusting a frequency division ratio of the first frequency divider to a first frequency division ratio based on the first clock signal; and perform a second calibration operation for adjusting the first frequency division ratio to a second frequency division ratio based on a sensed temperature.

Nested phase-locked loops (PLLs) utilize resonators of different quality factors, oscillation frequencies, and tunability. A reference clock signal for a first PLL is based on a free running bulk acoustic wave (BAW) resonator. The first PLL utilizes an LC oscillator as a voltage controlled oscillator. A crystal oscillator supplies a reference clock signal to a second PLL. Feedback dividers of the first and second PLLs are coupled to the LC oscillator. A delta sigma modulator coupled to the loop filter of the second PLL controls the feedback divider of the first PLL. The first PLL utilizes a high update rate to ensure that the jitter power spectral density is spread over a wide frequency range. The nested PLL architecture allows the overall phase noise plot to follow that of the crystal resonator at low frequencies, the BAW resonator at mid-frequencies, and the LC resonator at high frequencies.

An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.

An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.

A micro crystal oscillator includes: a tank body including a tank bottom and a side wall, the tank bottom including an inner surface and an outer surface, wherein the side wall is disposed on a periphery of the inner surface of the tank bottom to form a recess together with the tank bottom; a plurality of patterned electrodes arranged on the outer surface; a first patterned circuit arranged on the side wall; a plurality of vias disposed in the tank body for electrically connecting at least one of the patterned electrodes to the first patterned circuit; an oscillating chip arranged on the inner surface and located in the recess; and a plurality of connecting wires located in the recess and respectively connected to the oscillating chip and the first patterned circuit in a wire bonding manner; wherein the micro crystal oscillator is of millimeter level.

A micro crystal oscillator includes: a tank body including a tank bottom and a side wall, the tank bottom including an inner surface and an outer surface, wherein the side wall is disposed on a periphery of the inner surface of the tank bottom to form a recess together with the tank bottom; a plurality of patterned electrodes arranged on the outer surface; a first patterned circuit arranged on the side wall; a plurality of vias disposed in the tank body for electrically connecting at least one of the patterned electrodes to the first patterned circuit; an oscillating chip arranged on the inner surface and located in the recess; and a plurality of connecting wires located in the recess and respectively connected to the oscillating chip and the first patterned circuit in a wire bonding manner; wherein the micro crystal oscillator is of millimeter level.

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.

The present disclosure provides a real-time correction method for an Oven Controlled Crystal (Xtal) Oscillator (OCXO) and an electromagnetic receiver. The real-time correction method for an OCXO includes: performing frequency multiplication on a reference clock signal to generate a first measurement signal and a second measurement signal; identifying a rising edge of each pulse per second on the basis of the first measurement signal to obtain a gate time T; obtaining a frequency of the second measurement signal according to the gate time T; and adjusting a frequency of the reference clock signal at least on the basis that an absolute value of a difference between two adjacent frequencies obtained of the second measurement signal is greater than a standard frequency difference.

The present disclosure provides a real-time correction method for an Oven Controlled Crystal (Xtal) Oscillator (OCXO) and an electromagnetic receiver. The real-time correction method for an OCXO includes: performing frequency multiplication on a reference clock signal to generate a first measurement signal and a second measurement signal; identifying a rising edge of each pulse per second on the basis of the first measurement signal to obtain a gate time T; obtaining a frequency of the second measurement signal according to the gate time T; and adjusting a frequency of the reference clock signal at least on the basis that an absolute value of a difference between two adjacent frequencies obtained of the second measurement signal is greater than a standard frequency difference.