A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

Disclosed is a system and method for power line control of electrical fans. The system generates a sinusoidal wave using a crystal oscillator. Control information is added to the sinusoidal wave by routing the wave through a phase inversion circuit a predetermined intervals according to a protocol. The resulting control signal is sent on a power line. The control signal is received using a crystal filter, decoded and converted to executable instructions for controlling a fan motor.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

A vibrator device includes a semiconductor substrate, a vibrator element, a circuit element, a wiring, a processing circuit, and a through electrode. The semiconductor substrate has a first surface and an opposite-side second surface of the semiconductor substrate from the first surface. The vibrator element is provided at the first surface. The circuit element is provided at the first surface and includes an oscillation circuit. The wiring is provided at the first surface and electrically couples the vibrator element and the oscillation circuit. The processing circuit is provided at the second surface and processes an output signal of the oscillation circuit. The through electrode penetrates the semiconductor substrate and electrically couples the oscillation circuit and the processing circuit.

A vibrator device includes a semiconductor substrate, a vibrator element, a circuit element, a wiring, a processing circuit, and a through electrode. The semiconductor substrate has a first surface and an opposite-side second surface of the semiconductor substrate from the first surface. The vibrator element is provided at the first surface. The circuit element is provided at the first surface and includes an oscillation circuit. The wiring is provided at the first surface and electrically couples the vibrator element and the oscillation circuit. The processing circuit is provided at the second surface and processes an output signal of the oscillation circuit. The through electrode penetrates the semiconductor substrate and electrically couples the oscillation circuit and the processing circuit.

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

A method of operating an oscillator circuit comprising a resonator is provided. The method comprises maintaining a resonance of the resonator by a) connecting the resonator to an input voltage (V.sub.buf) for a first pulse period to charge the resonator only partially towards the input voltage (V.sub.buf); b) connecting the resonator to a second, lower, voltage for a second pulse period to discharge the resonator at least partially; and repeating steps a) and b) at a rate corresponding to the resonance of the resonator and with a phase corresponding to the resonance of the resonator, so as to maintain the resonance of the resonator.