An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

A package includes a first layer on which a quartz crystal resonator element is mounted; a second layer that is joined to the first layer and on which a circuit element mounted; a third layer that is joined to a surface of the second layer that is opposite in direction to a surface of the second layer, on which the circuit element is mounted; a connection pad that is provided on the first layer; an external lateral surface terminal that is electrically connected to the connection pad; resonance element wiring that electrically connects the connection pad and the external lateral surface terminal to each other, in which the resonance element wiring is positioned between the third layer and the second layer, and includes terminal wiring that is connected to the external lateral surface terminal and interlayer wiring that connects the connection pad and the terminal wiring.

An oscillator includes a resonator element, an oscillation circuit configured to oscillate the resonator element to generate a clock signal, a temperature sensor, a digital control circuit configured to operate based on the clock signal and output a control signal based on a temperature detected by the temperature sensor, a temperature control circuit configured to output a control voltage based on the control signal, a temperature control element configured to control a temperature of the resonator element based on the control voltage, and a clock signal abnormality detection circuit configured to detect an abnormality in the clock signal. The clock signal abnormality detection circuit stops an output of the control voltage to the temperature control element performed by the temperature control circuit when the abnormality in the clock signal is detected.

A circuit device includes a digital interface, a processor, an oscillation signal generation circuit, a clock signal generation circuit that generates a clock signal having frequency obtained through multiplication of a frequency of the oscillation signal, and terminal groups of the digital interface and the clock signal generation circuit. The terminal group of the digital interface is disposed in a first region along a first side of the circuit device, and the terminal group of the clock signal generation circuit is disposed in any one of second, third and fourth regions of the circuit device.

An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

An integrated circuit device includes a substrate, a joining part provided on the substrate and joined to a vibrator, and a plurality of bonding pads provided on the substrate. The joining part includes an insulating protective film that covers a part of a surface of the substrate, and no insulating protective film is provided between the adjacent bonding pads.

A circuit device includes an A/D conversion section adapted to perform an A/D conversion of a temperature detection voltage from a temperature sensor to output temperature detection data, a processing section adapted to perform a temperature compensation process of an oscillation frequency based on the temperature detection data to output frequency control data of the oscillation frequency, and an oscillation signal generation circuit adapted to generate an oscillation signal using the frequency control data and a resonator. The processing section may change the frequency control data in increments of kLSB (k1) based on a change in temperature.

An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

A method for manufacturing oscillators of a plurality of types including a first oscillator and a second oscillator, the method includes: manufacturing the first oscillator, the manufacturing the first oscillator including a first-oscillator first step of mounting, to a first container, a first resonator element and a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, and a first-oscillator second step of mounting, to the first container, a second resonator element whose oscillation frequency is controlled based on the first oscillation signal; and manufacturing the second oscillator, the manufacturing the second oscillator including a second-oscillator first step of mounting a third resonator element and a second circuit element to a second container of the same type as the first container, the third resonator element being of the same type as the first resonator element and the second circuit element being of the same type as the first circuit element and being configured to oscillate the third resonator element to generate a second oscillation signal, and a second-oscillator second step of mounting, to the second container, a fourth resonator element whose oscillation frequency is controlled based on the second oscillation signal and whose frequency is different from the frequency of the second resonator element.

A crystal unit with a built-in temperature sensor in a single chamber structure is provided and includes: a container, a depressed portion, an AT-cut quartz-crystal vibrating piece, a temperature sensor, two adhesion pads, and a pedestal made of a crystal disposed between the two adhesion pads and the AT-cut quartz-crystal vibrating piece. Depending on whether the AT-cut quartz-crystal vibrating piece is adhered to the pedestal at the two positions along the X-axis or is adhered to the pedestal at the two positions along the Z-axis, the pedestal made of the crystal has the X-axis, or the Z-axis or a Z-axis of the crystal in a direction parallel to a plane, and is adhered to the two adhesion pads in a positional relationship in which the axis of the pedestal is parallel to the first direction.