An example current mirror arrangement includes a current mirror circuit, configured to receive an input current signal at an input transistor Q1 and output a mirrored signal at an output transistor Q2. The arrangement further includes a semi-cascoding circuit that includes transistors Q3, Q4, and a two-terminal passive network. The transistor Q3 is coupled to, and forms a cascode with, the output transistor Q2. The transistor Q4 is coupled to the transistor Q3. The base/gate of the transistor Q3 is coupled to a bias voltage Vref, and the base/gate of the transistor Q4 is coupled to a bias voltage Vref1 via the two-terminal passive network. Nonlinearity of the output current from such a current mirror arrangement may be reduced by selecting appropriate impedance of the two-terminal passive network and selecting appropriate bias voltages Vref and Vref1.

An amplifier has a plurality of gate finger electrodes, two gate connection electrodes, a plurality of source electrodes and a plurality of drain electrodes, and a plurality of drain connection elements. The plurality of gate finger electrodes are arranged pectinate on the surface of the active region of the semiconductor substrate. The two gate connection electrodes connect in common each of both ends of the plurality of gate finger electrodes. The plurality of source electrodes and the plurality of drain electrodes are arranged alternately on the surface of the semiconductor substrate between the plurality of gate finger electrodes. The plurality of drain connection elements connects in sequence the plurality of drain electrodes. The ratio of the inductance value of each drain connection element to the parasitic capacitance of the drain-source electrodes between the corresponding drain electrode and the source electrode is constant.

A power voltage generator includes a booster, a voltage sensor, a constant voltage controller and a constant current controller. The booster is configured to boost an input voltage to an output voltage based on an on-off operation of a switch. The voltage sensor is configured to generate a sensing voltage by sensing the output voltage. The constant voltage controller is configured to generate a first switching signal to control the switch by comparing the sensing voltage with a reference voltage. The constant current controller is configured to generate a gain based on a ratio of an electrode signal of the switch and a target signal by comparing the electrode signal of the switch with the target signal.

A power voltage generator includes a booster, a voltage sensor, a constant voltage controller and a constant current controller. The booster is configured to boost an input voltage to an output voltage based on an on-off operation of a switch. The voltage sensor is configured to generate a sensing voltage by sensing the output voltage. The constant voltage controller is configured to generate a first switching signal to control the switch by comparing the sensing voltage with a reference voltage. The constant current controller is configured to generate a gain based on a ratio of an electrode signal of the switch and a target signal by comparing the electrode signal of the switch with the target signal.

An integrated circuit (IC) includes a first switch, a second switch, an amplifier electrically connected between the first switch and the second switch, and a base. The first switch, the second switch, and the amplifier are provided on the base. In a top view of the base, the amplifier is disposed between the first switch and the second switch.

Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.

A semiconductor chip includes a plurality of transistor rows. Corresponding to the plurality of transistor rows, a first bump connected to a collector of the transistor is arranged, and a second bump connected to an emitter is arranged. The transistor rows are arranged along sides of a convex polygon. A first land and a second land provided in a circuit board are connected to the first bump and the second bump, respectively. A first impedance conversion circuit connects the first land and the signal output terminal. A plurality of transistors in the transistor row are grouped into a plurality of groups, and the first impedance conversion circuit includes a reactance element arranged for each of the groups.

An example current mirror arrangement includes a current mirror circuit, configured to receive an input current signal at an input transistor Q1 and output a mirrored signal at an output transistor Q2. The arrangement further includes a semi-cascoding circuit that includes transistors Q3, Q4, and a two-terminal passive network. The transistor Q3 is coupled to, and forms a cascode with, the output transistor Q2. The transistor Q4 is coupled to the transistor Q3. The base/gate of the transistor Q3 is coupled to a bias voltage Vref, and the base/gate of the transistor Q4 is coupled to a bias voltage Vref1 via the two-terminal passive network. Nonlinearity of the output current from such a current mirror arrangement may be reduced by selecting appropriate impedance of the two-terminal passive network and selecting appropriate bias voltages Vref and Vref1.

An example current mirror arrangement includes a current mirror circuit, configured to receive an input current signal at an input transistor Q1 and output a mirrored signal at an output transistor Q2. The arrangement further includes a semi-cascoding circuit that includes transistors Q3, Q4, and a two-terminal passive network. The transistor Q3 is coupled to, and forms a cascode with, the output transistor Q2. The transistor Q4 is coupled to the transistor Q3. The base/gate of the transistor Q3 is coupled to a bias voltage Vref, and the base/gate of the transistor Q4 is coupled to a bias voltage Vref1 via the two-terminal passive network. Nonlinearity of the output current from such a current mirror arrangement may be reduced by selecting appropriate impedance of the two-terminal passive network and selecting appropriate bias voltages Vref and Vref1.

A collector layer is disposed on a substrate. The collector layer is a continuous region when viewed in plan. A base layer is disposed on the collector layer. An emitter layer is disposed on the base layer. An emitter mesa layer is disposed on the emitter layer. Two base electrodes are located outside the emitter mesa layer and within the base layer when viewed in plan. The two base electrodes are electrically connected to the base layer. Two capacitors are disposed on or above the substrate. Each of the two capacitors is connected between a corresponding one of the two base electrodes and a first line above the substrate. Two resistance elements are disposed on or above the substrate. Each of the two resistance elements is connected between a corresponding one of the two base electrodes and a second line on or above the substrate.