Devices and methods for operating a charge pump. In some implementations, a charge pump module includes a clock circuit configured generate to a first clock signal and a second clock signal, the first clock signal having a lower frequency than the second clock signal. The charge pump module also includes a driving circuit configured to generate a first set of clock signals based on the first clock signal and a second set of clock signals based on the second clock signal, the driving circuit coupled to the clock circuit. The charge pump module further includes a charge pump core including a set of capacitances, the charge pump core configured to charge the set of capacitances based the first set of clock signals and the second set of clock signals.

An acoustic wave device includes a silicon support substrate that includes first and second main surfaces opposing each other, a piezoelectric structure provided on the first main surface and including the piezoelectric layer, an IDT electrode provided on the piezoelectric layer, a support layer provided on the first main surface of the silicon support substrate and surrounding the piezoelectric layer, a cover layer provided on the support layer, a through-via electrode that extending through the silicon support substrate and the piezoelectric structure, and a first wiring electrode connected to the through-via electrode and electrically connected to the IDT electrode. The piezoelectric structure includes at least one layer having an insulating property, the at least one layer including the piezoelectric layer. The first wiring electrode is provided on the layer having an insulating property in the piezoelectric structure.

A multiplexer includes a transmission filter and a reception filter connected to a common terminal, a first inductor connected to the common terminal, and a multilayer substrate on which the transmission filter and the reception filter are mounted and which includes dielectric layers. The transmission filter includes a parallel-arm resonator connected to a path between the common terminal and a transmission terminal and a parallel-arm terminal, and a second inductor connected to the parallel-arm terminal and ground. The first inductor includes a first coil pattern on a first dielectric layer and a second coil pattern on a second dielectric layer. The second inductor includes a third coil pattern on the first dielectric layer and that is magnetically coupled to the first coil pattern. The inductance value of the second coil pattern is greater than that of the first coil pattern.

A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

Apparatus and methods for reconfigurable power amplifiers are disclosed. In certain embodiments, a mobile device includes a transceiver configured to generate a first radio frequency signal of a first frequency band and a second radio frequency signal of a second frequency band, and a front-end system including a push-pull power amplifier configured to selectively amplify one of the first radio frequency signal or the second radio frequency signal based on a band control signal. The push-pull power amplifier includes an input balun, an output balun, and a pair of amplifiers coupled between the input balun and the output balun. The band control signal is operable to control an output capacitance of the pair of amplifiers.

A power amplifier module includes an output-stage amplifier, a driver-stage amplifier, an input switch, an output switch, an input matching circuit, an inter-stage matching circuit, an output matching circuit, and a control circuit. The input switch selectively connects one of a plurality of input signal paths to an input terminal of the driver-stage amplifier. The output switch selectively connects one of a plurality of output signal paths to an output terminal of the output-stage amplifier. The control circuit controls operations of the driver-stage amplifier and the output-stage amplifier. The input switch, the output switch, and the control circuit are integrated into an IC chip. The control circuit is disposed between the input switch and the output switch.

A radio-frequency circuit includes a first power amplifier that outputs a first transmission signal and a second power amplifier that outputs a second transmission signal having a frequency different from a frequency of the first transmission signal. In a period in which the first transmission signal the second transmission signal are simultaneously outputted, at least one of the first power amplifier or the second power amplifier reduces transmission power of the at least one of the first power amplifier or the second power amplifier to cause a power component of intermodulation distortion superimposed on a transmission signal output from the first power amplifier and the second power amplifier to be less than or equal to a threshold value.

A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

An acoustic wave device includes a laminated film on a support substrate and inside a portion of an outer edge of the support substrate in plan view and including a piezoelectric thin film, an IDT electrode on the laminated film, an insulating layer on the support substrate and the laminated film and extending from a region above the support substrate to a region above the laminated film, a connecting electrode on the insulating layer and electrically connected to the IDT electrode, and an external connection terminal electrically connected to the connecting electrode and disposed directly on or above the connecting electrode and outside a region where the laminated film is on the support substrate. A principal surface of the support substrate on the laminated film side includes a recess at an outer edge of the laminated film, and the recess is covered with the insulating layer.