A radio-frequency circuit is capable of simultaneously transmitting a radio-frequency signal of a middle high band group (MHB) including B1 and B3, and a radio-frequency signal of a ultra-high band group (UHB) including n77, and includes: a first transfer circuit that transfers the MHB radio-frequency signal and a radio-frequency signal of a low band group (LB); and a second transfer circuit that transfers the UHB radio-frequency signal. The first transfer circuit includes: a power amplifier for B1 signals; a diplexer that demultiplexes and/or multiplexes the MHB radio-frequency signal and the LB radio-frequency signal; a transmission filter that is connected to the power amplifier and has, as a passband, a transmission band of B1; and a band-elimination filter that is disposed between the diplexer and the transmission filter, and has, as an attenuation band, a transmission band of n77. The second transfer circuit includes a power amplifier for n77 signals.

A power amplifier module includes an output-stage amplifier, a driver-stage amplifier, an input switch, an output switch, an input matching circuit, an inter-stage matching circuit, an output matching circuit, and a control circuit. The input switch selectively connects one of a plurality of input signal paths to an input terminal of the driver-stage amplifier. The output switch selectively connects one of a plurality of output signal paths to an output terminal of the output-stage amplifier. The control circuit controls operations of the driver-stage amplifier and the output-stage amplifier. The input switch, the output switch, and the control circuit are integrated into an IC chip. The control circuit is disposed between the input switch and the output switch.

In some embodiments, radio-frequency amplifiers can include a plurality of narrow band power amplifiers implemented. Each narrow band power amplifier can be configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band. Each narrow band power amplifier can be sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers.

An amplifier may include multiple stages, with the multiple stages arranged in a fan-out configuration. The fan-out configuration provides multiple amplified signals at multiple amplifier output nodes, which may be coupled to a shared set of downconverters. The shared downconverters may support processing of only a smaller bandwidth than the largest possible bandwidth of an input RF signal input to the amplifier. For example, the downconverters may support a bandwidth matching a smallest bandwidth of a supported RF signal. For example, when the amplifier is intended to support 5G mmWave RF signals and 5G sub-6 GHz RF signals, the downconverters may each individually support a bandwidth of carriers in the 5G sub-6 GHz RF signals but not individually support the entire bandwidth of a possible 5G mmWave RF signal.

A radio frequency circuit includes: a first power amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal each having a different frequency; and a second power amplifier capable of amplifying the second radio frequency signal. In a case where the first radio frequency signal and the second radio frequency signal are simultaneously transmitted, (i) under a condition that a sum of a bandwidth of the first radio frequency signal and a bandwidth of the second radio frequency signal is broader than or equal to a predetermined bandwidth, the first radio frequency signal is amplified by the first power amplifier, and the second radio frequency signal is amplified by the second power amplifier, and (ii) under a condition that the sum is narrower than the predetermined bandwidth, the first radio frequency signal and the second radio frequency signal are amplified by the first power amplifier.

A radio frequency module includes: a module board including first and second principal surfaces; first and second power amplifiers on the first principal surface; external-connection terminals on the second principal surface; and first and second via conductors connecting the first and second principal surfaces. The first and second via conductors are spaced apart in the module board, one end of the first via conductor is connected to a first ground electrode of the first power amplifier, the other end of the first via conductor is connected to a first external-connection terminal, one end of the second via conductor is connected to a second ground electrode of the second power amplifier, the other end of the second via conductor is connected to a second external-connection terminal, and the first and second via conductors each penetrate through the module board in a direction normal to the first and second principal surfaces.

Aspects of the disclosure include a wireless device comprising a module input to receive an input signal, a module output to provide an amplified output signal, a low-noise amplifier including an input amplification stage coupled to the input, and a plurality of output amplification stages switchably coupled to the input amplification stage, and a plurality of impedance-matching circuits, each impedance-matching circuit of the plurality of impedance-matching circuits having an input coupled to a respective output amplification stage and an output coupled to the module output.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.

A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.

An output switch includes; a plurality of input terminals and output terminals each of the plurality of input terminals is electrically connected to at least one of the plurality of output terminals; a first low noise amplifier that amplifies a signal of a predetermined frequency band input through an antenna and outputs a first signal to a first input terminal among the plurality of input terminals, and a second low noise amplifier that amplifies a signal of a predetermined frequency band input through an antenna and outputs a second signal to a second input terminal different from the first input terminal among the plurality of input terminals. A filter that attenuates a signal of a frequency band higher than a frequency band of the second signal is electrically connected between the second input terminal and the second low noise amplifier.