A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

The present disclosure relates to a concept for a transformer, a transmitter circuit, a semiconductor chip, a semiconductor package, a base station, a mobile device and a method for a radio frequency transmitter. The transformer for a radio frequency transmitter circuit comprises a primary coil and a secondary coils, which are configured to receive an input signal and to provide an output signal, and a ternary coil configured to provide a feedback signal.

Embodiments disclosed herein include electronic packages and their components. In an embodiment, an electronic package comprises a package substrate and a base die over the package substrate. In an embodiment, the electronic package further comprises a plurality of chiplets over the base die. In an embodiment, the base die comprises a substrate, a first metal layer and a second metal layer between the substrate and the plurality of chiplets, and a third metal layer and a fourth metal layer between the package substrate and the substrate. In an embodiment, a filter is integrated into one or more layers of the base die.

According to an aspect, a tank circuit in an integrated circuit comprising a plurality of metal strips forming a first part of a closed contour enclosing a first area, a set of split sections forming a second part and geometrically aligned with the closed contour, and a plurality of capacitors coupled between the split sections to form the tank circuit, wherein a first flux linkage due a current flowing in the set of split sections pass through the first area in the same direction as that of a second flux linkage due to the current flowing in the plurality of metal strips, and the set of split sections and the plurality of metal strips together forming an inductance coil.

A trifilar transformer comprising: a first winding; a second winding; and a third winding, wherein one winding is mutually coupled to each of the other two windings, and wherein said other two windings are substantially not coupled to each other. At least one of the first winding, the second winding and the third winding may comprise a figure-of-eight winding, e.g. a clockwise loop and an anti-clockwise loop. In some embodiments, the trifilar transformer may comprise: a first winding; a second winding concentric or interwound with the first winding; and a third winding formed from a first winding part in series with a second winding part, the first winding part having a shape corresponding to the first winding and the second winding part having a shape corresponding to the second winding.

In one embodiment, a tuning network includes: a controllable capacitance; a first switch coupled between the controllable capacitance and a reference voltage node; a second switch coupled between the controllable capacitance and a third switch; the third switch coupled between the second switch and a second voltage node; a fourth switch coupled between the second voltage node and a first inductor; the first inductor having a first terminal coupled to the fourth switch and a second terminal coupled to at least the second switch; and a second inductor having a first terminal coupled to the second terminal of the first inductor and a second terminal coupled to the controllable capacitance.

An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first and second metal layers and coupled to one of the first and second plates in a resonant circuit.

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

Provided are a capacitor and a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.