Systems and methods are disclosed for on-chip harmonic filtering for radio frequency (RF) communications. For disclosed embodiments, a filter circuit is coupled between a first internal node and a connection pad for an integrated circuit. The filter circuit includes a first inductance, a variable capacitance, and a second inductance. The capacitance amount for the variable capacitance is controlled to tune filtering for the filter circuit to a harmonic of a frequency for a transmit output signal. A power amplifier outputs the transmit output signal to the connection pad without passing through the filter circuit. The filter circuit filters the harmonic of the frequency for the transmit output signal, shunting harmonic current to ground. For one embodiment, the filtered harmonic is a third harmonic of the transmit frequency. For one embodiment, the transmit output signal has an output power greater than or equal to 15 dBm.

An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.

An aspect of the disclosure relates to a receiver, including: a low noise amplifier (LNA); and an input stage coupled to the LNA, wherein the input stage is configured to provide a first passband for a first signal across at least a portion of a first frequency band and a notch to substantially reject a second signal within the first frequency band or a second frequency band in accordance with a first mode of operation, and a second passband for the second signal across the second frequency band in accordance with a second mode of operation. In the first mode, the input stage includes a parallel L-C resonance frequency and an L-match impedance matching circuit. In the second mode, the input stage includes a modified bridge T-coil impedance matching circuit with substantially no electromagnetic coupling between the inductors of the circuit.

An Integrated Circuit (IC) containing at least one printed transformer-based matching network, which comprises: a) at least one printed transformer-based matching network with reduced size, which comprises a printed transformer with multiple internal ports in the form of electromagnetic discontinuities, introduced along the transverse dimension of the printed transformer; reactive elements, added to of the internal ports to thereby increase the order of the transformer-based matching network, the one or more reactive elements are printed along the transverse dimension of the matching network; a printed component connected to the input port of the matching network; a printed component connected to the output port of the matching network.

A transformer device includes a first coil, a second coil, and a third coil. The first coil includes a first ring structure, a second ring structure, a first connecting portion, and a first terminal, in which the first terminal is arranged on the first connecting portion and is located at a central location between the first ring structure and the second ring structure, the first terminal is connected to the first ring structure through the first connecting portion in a first direction, and connected to the second ring structure through the first connecting portion in a second direction, and the first direction is the opposite of the second direction. The second coil is configured to couple the first ring structure. The third coil is configured to couple the second ring structure, in which the second coil and the third coil have the same structure.

An LC composite component comprising an element body, a helically wound coil disposed in the element body, and a capacitor disposed on an outer circumferential side of the coil in the element body. When viewed in an axial direction of the coil, the element body is rectangular, and the capacitor is disposed between at least two sides of the element body and the coil.

Provided a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.

Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic wave filter with an integrated passive device (IPD) filter. The acoustic wave filter provides selectivity at fundamental frequency band while the IPD filter provides rejection at harmonic frequency bands.

Embodiments of a method and an apparatus for a quadrature hybrid are disclosed. In an embodiment, a quadrature hybrid includes a first port, a second port, a third port, a fourth port, first, second, and third inductors, first, second, third, and fourth capacitors, and a first variable capacitor tuning network connected between the first port and the fourth port, and a second variable capacitor tuning network connected between the second port and the third port.

A wireless transceiver circuit with an impedance matching network within an integrated circuit is disclosed. In some embodiments, the impedance matching network utilizes an inductor, having two portions, disposed on two different metal layers of the integrated circuit. The first end of the first portion of the inductor is in communication with an antenna. The second end of the second portion is in communication with a low noise amplifier for receiving signals and a power amplifier for transmitting RF signals. The second end of the first portion is connected to the first end of the second portion using a via. In another embodiment, the two portions are disposed on the same metal layer, wherein one portion is disposed within the other with a gap separating the two portions. These configurations require less space than using two separate inductors and also have a low coupling coefficient.