An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first and second metal layers and coupled to one of the first and second plates in a resonant circuit.

The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).

A filter structure includes a capacitive device and an inductive device. The capacitive device includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, and a dielectric layer between the ground plane and the plate. The inductive device includes first and second conductive paths in a third metal layer of the IC package, each of the first and second conductive paths is electrically connected to the plate and has a width w, the first and second conductive paths are separated by a spacing s, and a ratio s/w has a value ranging from 1 to 2.

A vibrator device includes a first excitation electrode, a first pad electrode, and a first drawn wiring line that are disposed at a first surface of a vibrator element, a second excitation electrode, a second pad electrode, and a second drawn wiring line that are disposed at a second surface of the vibrator element, and a spiral first electrode pattern disposed at the first surface of the vibrator element. The first excitation electrode and the second excitation electrode are disposed so as to face each other with the vibrator element therebetween. A first central end section of the first electrode pattern is electrically coupled to the second drawn wiring line via a through electrode provided in the vibrator element. A first outer circumferential end section of the first electrode pattern is electrically coupled to the first drawn wiring line. The first drawn wiring line is electrically coupled to at least one of the first excitation electrode and the first pad electrode. The second drawn wiring line is electrically coupled to at least one of the second excitation electrode and the second pad electrode.

The present invention relates to a high-frequency semiconductor device. A conventional high-frequency semiconductor device including an input second-order harmonic matching circuit has such a problem that gain decrease occurs. In a high-frequency semiconductor device (100) of the present invention, two adjacent unit transistor cells (7) and (8) are connected to one input second-order harmonic matching circuit (19) provided on an upper surface of a semiconductor substrate (1). The input second-order harmonic matching circuit (19) includes a first capacitor (13), a first inductor (14), a second capacitor (15), and a second inductor (16). The first capacitor (13) and the first inductor (14) resonate at the frequency of a fundamental wave, and each of impedances as seen by input electrodes of the two unit transistor cells (7) and (8) is short-circuited at the frequency of a second-order harmonic.

A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.

A filter device includes series and parallel arm resonators provided at a filter chip and inductors electrically connected in series with respective ones of the parallel arm resonators. A first inductor having the highest inductance of the inductors is electrically connected in series with a first parallel arm resonator having the highest anti-resonant frequency of the parallel arm resonators. One end of the first parallel arm resonator and one end of a second parallel arm resonator in other ones of the parallel arm resonators are electrically connected to a same wiring line in wiring lines separated by the series arm resonators on a line electrically connecting an input terminal and an output terminal of the filter chip. The other ends of the first and second parallel arm resonators are respectively electrically connected to first and second ground terminals of the filter chip.

In a first approach, a reconfigurable radio frequency (RF) filtering module includes a phase-change material (PCM) RF switch bank and an RF filter bank. Each RF filter in the RF filter bank is capable to be engaged and disengaged by a PCM RF switch in the PCM RF switch bank. In a second approach, a tunable RF filter includes PCM RF switches and a capacitor and/or an inductor. Each of the capacitor and/or inductor is capable to be engaged and disengaged by at least one PCM RF switch of the PCM RF switches. In a third approach, an adjustable passive component includes multiple segments and a PCM RF switch. A selectable segment in the multiple segments is capable to be engaged and disengaged by the PCM RF switch. In all approaches, each PCM RF switch includes a PCM and a heating element transverse to the PCM.

In one embodiment, a tuning network includes: a controllable capacitance; a first switch coupled between the controllable capacitance and a reference voltage node; a second switch coupled between the controllable capacitance and a third switch; the third switch coupled between the second switch and a second voltage node; a fourth switch coupled between the second voltage node and a first inductor; the first inductor having a first terminal coupled to the fourth switch and a second terminal coupled to at least the second switch; and a second inductor having a first terminal coupled to the second terminal of the first inductor and a second terminal coupled to the controllable capacitance.

In a common mode choke coil having a magnetic core, a decrease in peak value of a common mode impedance in a vicinity of its resonance frequency is suppressed. A common mode choke coil includes a non-magnetic layer, a first magnetic layer formed on a top surface of the non-magnetic layer, a second magnetic layer formed on a bottom surface of the non-magnetic layer, a magnetic core provided between the first magnetic layer and the second magnetic layer so that its axis extends in a top-bottom direction, a first coil conductor embedded in the non-magnetic layer and wound around the magnetic core, a second coil conductor embedded in the non-magnetic layer and wound around the magnetic core, and a first magnetic gap provided between a top surface of the magnetic core and a bottom surface of the first magnetic layer. The magnetic core is made of a ferrite material.