H03H2001/0078

RFIC module, RFID tag, and article
11093812 · 2021-08-17 · ·

An RFIC module is provided that includes a first planar conductor and a second planar conductor that faces each other. Moreover, an inductor is provided of which both ends are connected between the first planar conductor and the second planar conductor. An RFIC also has both ends connected between the first planar conductor and the second planar conductor. In a plan view of the first planar conductor, the inductor is adjacent to a first point that is at an outer edge of the first planar conductor, and the RFIC is adjacent to a second point of the outer edges of the first planar conductor. In addition, the second point is positioned away from the first point.

High power surface mount filter

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

POWER COMBINER/DIVIDER
20210297051 · 2021-09-23 ·

A power combiner/divider circuit can be structured having a base structure with the addition of an odd-mode capacitor and a low pass network at an end of the base structure or structured having a base structure with the addition of an inductor and a high pass network at an end of the base structure. The power combiner/divider circuit can be implemented as a port coupled to multiple ports with low pass networks or high pass networks arranged at the ends of paths to the multiple ports. In embodiments using low pass base structures or low pass networks coupled to the base structures, inductors in such low pass sections can be positively coupled on a pair-wise basis.

BAW RESONATOR WITH COIL INTEGRATED IN HIGH IMPEDANCE LAYER OF BRAGG MIRROR OR IN ADDITIONAL HIGH IMPEDANCE METAL LAYER BELOW RESONATOR
20210203303 · 2021-07-01 ·

It is proposed to enhance the bandwidth of a SMR BAW resonator (TE,PL,BE) by circuiting it with a planar coil (WG1, WG2) that is realized in a high impedance layer (HI) of the Bragg mirror (BM) or in an additional metal layer below the Bragg mirror.

Directional coupler

A directional coupler includes a main line for transmitting a high frequency signal, a sub line electromagnetically coupled to the main line, a termination circuit for terminating one end portion of the sub line, and a variable filter that has an input terminal and an output terminal and the input terminal is connected to another end portion of the sub line. The variable filter is a filter unit circuit having one frequency band as a pass band or a stop band, and in the filter unit circuit, a variable passive element for shifting a frequency in the pass band or the stop band is disposed.

Power combiner/divider

A power combiner/divider circuit can be structured having a base structure with the addition of an odd-mode capacitor and a low pass network at an end of the base structure or structured having a base structure with the addition of an inductor and a high pass network at an end of the base structure. The power combiner/divider circuit can be implemented as a port coupled to multiple ports with low pass networks or high pass networks arranged at the ends of paths to the multiple ports. In embodiments using low pass base structures or low pass networks coupled to the base structures, inductors in such low pass sections can be positively coupled on a pair-wise basis.

HYBRID THREE DIMENSIONAL INDUCTOR
20210281234 · 2021-09-09 ·

An improved filter for high frequency, such as 5G wireless communication, may include inductor-Q improvement and reduced die-size with a hybrid 3D-inductor integration. In some examples, the inductors may be formed using an IPD and a fan-out package. For instance, a first multilayer substrate comprises a plurality of metal insulator metal (MIM) capacitors formed using various layers (e.g., M1 and M2) and a first portion of the 3D inductors, and a second multilayer substrate comprises at least a second portion of the 3D inductors. The 3D inductors may be electrically coupled to the MIM capacitors to form at least one filter network.

COMPOSITE FILTER DEVICE AND BAND PASS FILTER
20210194460 · 2021-06-24 ·

A composite filter device includes a connection portion connected to a common terminal, a first filter between the connection portion and a first terminal, a second filter between the connection portion and a second terminal, a first inductor that is connected in series between the second filter and the connection portion, includes a first wiring electrode wound in a predetermined direction, and is provided at an internal layer of a multilayer board, and a second inductor that is connected in series between the common terminal and the connection portion, includes a second wiring electrode wound in the predetermined direction, and is provided at an internal layer of the multilayer board. The first and second wiring electrodes at least partially overlap when the multilayer board is viewed in plan.

Compensation of on-die inductive parasitics in ladder filters through negative mutual inductance between ground inductors

Compensation of on-die inductive parasitics in ladder filters through negative mutual inductance between ground inductors is disclosed herein. An exemplary ladder filter includes a primary arm of series resonators and two or more shunt resonator arms connecting nodes between the series resonators to ground. The resonators of the ladder filter are disposed over a semiconductor substrate, to form a circuit die. Constructed ladder filter dice may fail to achieve design filter rejection due to inductive parasitics (e.g., undesired magnetic induction between components). A first shunt arm and a second shunt arm are provided with mutual negatively coupled inductors in order to compensate for these parasitics and improve filter performance.

Providing a programmable inductor to enable wide tuning range

In one embodiment, a tuning network includes: a controllable capacitance; a first switch coupled between the controllable capacitance and a reference voltage node; a second switch coupled between the controllable capacitance and a third switch; the third switch coupled between the second switch and a second voltage node; a fourth switch coupled between the second voltage node and a first inductor; the first inductor having a first terminal coupled to the fourth switch and a second terminal coupled to at least the second switch; and a second inductor having a first terminal coupled to the second terminal of the first inductor and a second terminal coupled to the controllable capacitance.