Patent classifications
H03H3/013
Quartz crystal resonator and method for manufacturing the same, and quartz crystal resonator unit and method for manufacturing the same
A method for manufacturing a quartz crystal resonator that includes a quartz crystal blank having a vibrating portion including a center of a principal surface of the quartz crystal blank when viewed in plan from a direction normal to the principal surface and a peripheral portion adjacent to the vibrating portion, a pair of excitation electrodes disposed opposite to each other with the vibrating portion interposed therebetween, a pair of electrode pads disposed on the peripheral portion, and a pair of extended electrodes each extending from the vibrating portion to the peripheral portion to electrically connect one excitation electrode to a corresponding electrode pad, where the method includes conducting a first trimming of the vibrating portion and the peripheral portion; and conducting a second trimming of part of one of the excitation electrodes on the vibrating portion.
Filter component tuning using size adjustment
A method for tuning a filter component using size adjustment includes measuring a first frequency of a first resonant mode of a dielectric resonator component of an RF filter, said dielectric resonator component being a block of dielectric material having a cuboid shape with three pairs of opposite faces. The first resonant mode has an electric-field component oriented in a direction perpendicular to one of the pairs of opposite faces and parallel to the other two pairs of opposite faces. When a measured value of the first frequency of the first resonant mode is less than a desired value, dielectric material is removed uniformly from at least one face of the two pairs of opposite faces parallel to the electric-field component of the first resonant mode to maintain the cuboid shape of the block of dielectric material. The removal of the dielectric material may be by at least one of lapping, grinding, and milling. The first frequency of the first resonant mode is remeasured to check whether a remeasured value therefor is closer or equal to the desired value without exceeding the desired value. The method is also applicable for tuning multiple modes of dielectric resonator component in the form of a block of dielectric material having a cuboid shape, as well as for tuning multiple modes in dielectric resonator components in the form of blocks of dielectric material having cylindrical and spherical shapes.
Filter component tuning using size adjustment
A method for tuning a filter component using size adjustment includes measuring a first frequency of a first resonant mode of a dielectric resonator component of an RF filter, said dielectric resonator component being a block of dielectric material having a cuboid shape with three pairs of opposite faces. The first resonant mode has an electric-field component oriented in a direction perpendicular to one of the pairs of opposite faces and parallel to the other two pairs of opposite faces. When a measured value of the first frequency of the first resonant mode is less than a desired value, dielectric material is removed uniformly from at least one face of the two pairs of opposite faces parallel to the electric-field component of the first resonant mode to maintain the cuboid shape of the block of dielectric material. The removal of the dielectric material may be by at least one of lapping, grinding, and milling. The first frequency of the first resonant mode is remeasured to check whether a remeasured value therefor is closer or equal to the desired value without exceeding the desired value. The method is also applicable for tuning multiple modes of dielectric resonator component in the form of a block of dielectric material having a cuboid shape, as well as for tuning multiple modes in dielectric resonator components in the form of blocks of dielectric material having cylindrical and spherical shapes.
BAW resonator with reduced heat build-up, HF filter comprising BAW resonator, duplexer comprising HF filter, and production method
The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.
ASSEMBLY PROCESSES FOR THREE-DIMENSIONAL MICROSTRUCTURES
Three-dimensional microstructure devices having substantially perfect alignment and leveling of a three-dimensional microstructure with respect to a substrate having a plurality of discrete electrodes and relating fabricating methods are disclosed. Seed layers are deposited onto the discrete electrodes of the substrate, and the three-dimensional microstructure is bonded adjacent to the seed layers. A substantially uniform sacrificial layer is deposited onto exposed surfaces of the three-dimensional microstructure. A plurality of first gaps exists between the seed layers and corresponding regions of the sacrificial layer. Conductive layers are deposited to fill the first gaps. The sacrificial layer is dissolved to create a second plurality of gaps between the conductive layers and the corresponding regions of the three-dimensional microstructure. The second gaps are substantially uniform.
ASSEMBLY PROCESSES FOR THREE-DIMENSIONAL MICROSTRUCTURES
Three-dimensional microstructure devices having substantially perfect alignment and leveling of a three-dimensional microstructure with respect to a substrate having a plurality of discrete electrodes and relating fabricating methods are disclosed. Seed layers are deposited onto the discrete electrodes of the substrate, and the three-dimensional microstructure is bonded adjacent to the seed layers. A substantially uniform sacrificial layer is deposited onto exposed surfaces of the three-dimensional microstructure. A plurality of first gaps exists between the seed layers and corresponding regions of the sacrificial layer. Conductive layers are deposited to fill the first gaps. The sacrificial layer is dissolved to create a second plurality of gaps between the conductive layers and the corresponding regions of the three-dimensional microstructure. The second gaps are substantially uniform.
High quality factor integrated acoustic resonant metamaterials with large frequency tuning range for reconfigurable radio-frequency front-ends
Piezoelectric acoustic metamaterial resonators include a piezoelectric substrate having a top surface and a bottom surface and a plurality of magnetostrictive members disposed on the top surface of the piezoelectric substrate and extending along a length of the piezoelectric substrate and spaced across a width of the piezoelectric substrate.
High quality factor integrated acoustic resonant metamaterials with large frequency tuning range for reconfigurable radio-frequency front-ends
Piezoelectric acoustic metamaterial resonators include a piezoelectric substrate having a top surface and a bottom surface and a plurality of magnetostrictive members disposed on the top surface of the piezoelectric substrate and extending along a length of the piezoelectric substrate and spaced across a width of the piezoelectric substrate.
Gm-C filter and multi-phase clock circuit
Described herein is a power-efficient Gm-C filter, wherein the Gm-C filter includes several operational transconductance amplifiers (OTAs). In an example, at least two of the OTAs share a common bias current. Further, output of one of the OTAs is used to bias another one of the OTAs. Also described herein is a power-efficient clock generator circuit that is configured to output non-overlapping clock signals. The clock generator circuit includes a ring oscillator circuit, which includes several inverter stages. The clock generator circuit is well-suited for controlling operation of switches.
Trimming method for microresonators and microresonators made thereby
A micromechanical resonator is disclosed. The resonator includes a resonant micromechanical element. A film of annealable material deposited on a facial surface of the element. In one instance, the resonance of the element can be adjusting by using a feedback loop to control annealing of the deposited film.