A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.

A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.

Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.

The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range.

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

A resonator is provided that includes a vibration member that includes a substrate, a metal layer formed along one of main surfaces of the substrate, and a piezoelectric thin film disposed between the substrate and the metal layer. The vibration member vibrates such that a main vibration is a contour vibration. Moreover, a frame surrounds at least a portion of the vibration member, and a support unit connects the vibration member to the frame. The vibration member includes depressed portions on or above the one of main surfaces where the piezoelectric thin film is removed.

A method for manufacturing a quartz crystal resonator that includes a quartz crystal blank having a vibrating portion including a center of a principal surface of the quartz crystal blank when viewed in plan from a direction normal to the principal surface and a peripheral portion adjacent to the vibrating portion, a pair of excitation electrodes disposed opposite to each other with the vibrating portion interposed therebetween, a pair of electrode pads disposed on the peripheral portion, and a pair of extended electrodes each extending from the vibrating portion to the peripheral portion to electrically connect one excitation electrode to a corresponding electrode pad, where the method includes conducting a first trimming of the vibrating portion and the peripheral portion; and conducting a second trimming of part of one of the excitation electrodes on the vibrating portion.

A method for manufacturing a quartz crystal resonator that includes a quartz crystal blank having a vibrating portion including a center of a principal surface of the quartz crystal blank when viewed in plan from a direction normal to the principal surface and a peripheral portion adjacent to the vibrating portion, a pair of excitation electrodes disposed opposite to each other with the vibrating portion interposed therebetween, a pair of electrode pads disposed on the peripheral portion, and a pair of extended electrodes each extending from the vibrating portion to the peripheral portion to electrically connect one excitation electrode to a corresponding electrode pad, where the method includes conducting a first trimming of the vibrating portion and the peripheral portion; and conducting a second trimming of part of one of the excitation electrodes on the vibrating portion.

A method for tuning a filter component using size adjustment includes measuring a first frequency of a first resonant mode of a dielectric resonator component of an RF filter, said dielectric resonator component being a block of dielectric material having a cuboid shape with three pairs of opposite faces. The first resonant mode has an electric-field component oriented in a direction perpendicular to one of the pairs of opposite faces and parallel to the other two pairs of opposite faces. When a measured value of the first frequency of the first resonant mode is less than a desired value, dielectric material is removed uniformly from at least one face of the two pairs of opposite faces parallel to the electric-field component of the first resonant mode to maintain the cuboid shape of the block of dielectric material. The removal of the dielectric material may be by at least one of lapping, grinding, and milling. The first frequency of the first resonant mode is remeasured to check whether a remeasured value therefor is closer or equal to the desired value without exceeding the desired value. The method is also applicable for tuning multiple modes of dielectric resonator component in the form of a block of dielectric material having a cuboid shape, as well as for tuning multiple modes in dielectric resonator components in the form of blocks of dielectric material having cylindrical and spherical shapes.

Target mode frequencies are calculated for a defined filter component used as a reference for filter components to be tuned. The defined filter component has resonant mode(s), each having a mode frequency which can be tuned to a corresponding target mode frequency via physical adjustment of parameter(s) of the filter component. A tuning equation is formed by linearly relating, via a slope matrix, changes in the mode frequencies to corresponding physical adjustment in the parameter(s), and by using an inverse of the slope matrix as part of the tuning equation. A tuning procedure is performed for a filter component to be tuned, comprising: determining, using the tuning equation, adjustment information for parameter(s) of the filter component to adjust measured mode frequency(ies) of the filter component toward meeting corresponding target mode frequency(ies) for the resonant mode(s) within corresponding tolerance(s); and outputting the determined adjustment information for physical adjustment of the parameter(s).