A switchable reactance unit includes an RF terminal configured to connect to a transmission line for transmitting a signal at a frequency in a range of 1 - 200 MHz, and a switching arrangement comprising a plurality of switching elements used in parallel. Each switching element has a control terminal, and is connected to the RF terminal via at least one individual reactance assigned to the switching element and connected in series with the switching element. The switching elements are controllable or controlled via their control terminals in such a way that they switch simultaneously.

A filter includes a first capacitor connected in series between a first terminal pair and a second terminal pair, a first inductor connected in parallel with the first capacitor, and a second inductor connected in parallel between the first terminal pair and the second terminal pair. The first inductor and the second inductor are magnetically coupled to each other and are differentially connected to each other.

An electronic device is provided. The electronic device includes an antenna, a wireless communication circuit, and a diplexer. The diplexer includes a first port, and second and third ports connected to the wireless communication circuit, a low pass filter (LPF) configured to filter an RF signal of a low frequency band from a signal received from one of the first port and the second port and output same to the other one of the first port and the second port, and a high pass filter (HPF) configured to filter an RF signal of a high frequency band from a signal received from one of the first port and the third port and output same to the other one of the first port and the third port.

A system for the verification of the absence of voltage has a first series of resistors and a first voltage limiter connected between a power line and a first voltage sensor and such as to limit a sensed voltage to a set amount above a threshold set by a standard and a first series of LC resonance filters connected between the power line and a RF signal generator. The system also has a second series of resistors and a second voltage limiter connected between the power line and a second voltage sensor and a second series of LC resonance filters connected between the power line and an RF signal detector. The system is configured to detect continuity to the voltage line by sending an RF signal generated by the RF signal generator through the first lead line and detecting it at the RF signal detector via the second lead line.

A power noise filter and a supply modulator including the same, and a wireless communication device including the power noise filter are provided. The power noise filter includes a band stop filter and a low pass filter. The band stop filter includes an inductor and a first capacitor, which are connected in parallel between first and second nodes. The first node receives a first voltage, which is filtered by the band pass filter to thereby generate a second voltage at the second node. The first low pass filter includes the inductor and a second capacitor, which has one end connected to the second node and an opposite end connected to a ground source.

A substrate support including a body, a heating element, a first radio frequency filter, and a second radio frequency filter. The body is configured to support a substrate. The heating element is at least partially implemented in a first portion of the body. The first radio frequency filter is connected to an input of the heating element and at least partially implemented in a second portion of the body and connected to the heating element by a first via. The second radio frequency filter is connected to an output of the heating element and at least partially implemented in the second portion or a third portion of the body.

A filter includes an input terminal, an output terminal, a ground terminal, a first capacitor and a second capacitor that are connected in series between the input terminal and the output terminal, a capacitive element that is connected in parallel to the first capacitor and the second capacitor between the input terminal and the output terminal, and has a Q factor that is smaller than a Q factor of the first capacitor and is smaller than a Q factor of the second capacitor, and an inductor that has a first end and a second end, the first end being coupled to a node that is provided between the first capacitor and the second capacitor and that is coupled to the capacitive element through the first capacitor and the second capacitor, the second end being coupled to the ground terminal.

A filter includes an input terminal, an output terminal, a first ground terminal, a second ground terminal, a first inductor having a first end coupled to a first node in a path between the input terminal and the output terminal and a second end coupled to a second node, a second inductor having a first end coupled to the second node and a second end coupled to the first ground terminal, and a third inductor having a first end coupled to the second node and a second end coupled to the second ground terminal.

Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic wave filter with an integrated passive device (IPD) filter. The acoustic wave filter provides selectivity at fundamental frequency band while the IPD filter provides rejection at harmonic frequency bands.

Disclosed is a radio frequency integrated circuit (RFIC) chip that includes an integrated circuit (IC) area and a crackstop laterally surrounding the IC area. The crackstop includes a metallic barrier (or, alternatively, concentric metallic barriers) electrically isolated from the IC area. One or more noise suppressors and, particularly, one or more passive filters (e.g., low pass filter(s), high pass filter(s), band pass filter(s), and/or band stop filter(s)) are integrated into the structure of the metallic barrier(s) to inhibit propagation, through the crackstop, of noise signals within a specific RF range. The specific RF range can be a customer-specified operating parameter. By embedding customized noise suppressor(s) into the crackstop, local signal interference unique to the customer-specified operating parameters can be minimized while also avoiding or at least minimizing the risk of moisture ingress to the IC area. Also disclosed is a method of forming the chip.