The disclosure relates to an ultra-wide passband five-order band-pass filter based on an LTCC process. The ultra-wide passband five-order band-pass filter comprises a ceramic substrate, a bottom input electrode, a bottom output electrode and a bottom grounding electrode. Five parallel resonators, a grounding polar plate, two series connection capacitors, two series connection inductors, a cross-coupling capacitor and a parallel inductor are arranged in the ceramic substrate; the two series connection capacitors comprise a first series capacitor and a second series capacitor; the two series connection inductors comprise a first series inductor and a second series inductor; and according to the filter, a five-order parallel resonance structure is adopted, out-of-band suppression is deepened through the five parallel resonance units, a cross coupling capacitor, a parallel inductor and two series connection inductors are innovatively introduced.

A communication system includes a transmitter configured to transmit a modulated signal, a transmission line configured to carry the modulated signal, and a receiver coupled to the transmitter by the transmission line, and configured to receive the modulated signal. The transmitter includes a modulator configured to generate the modulated signal responsive to a data signal and a carrier signal. The receiver includes a demodulator configured to demodulate the modulated signal responsive to a first carrier signal. The demodulator includes a filter and a gain adjusting circuit configured to adjust a gain of the filter, and to generate the set of control signals based on a voltage of the filtered first signal and a voltage of the first signal. The gain adjusting circuit includes a first peak detector coupled to the filter, and configured to detect a peak value of the voltage of the filtered first signal.

The invention relates to an electrical filter element (1) for filtering alternating voltage interference. The electrical filter element (1) comprises two dielectric circuit board substrates (11, 12) having a magnetic core (13) arranged between the circuit board substrates. The magnetic core (13) has a material-free inner region (13a), in which electrical connection elements (21-24) are provided between the two dielectric circuit board substrates (11, 12). Furthermore, electrical connection elements (31, 32) can also be provided between the two dielectric circuit board substrates (11, 12) in an outer region of the magnetic core (13).

An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.

Embodiments of the invention include a plasma system. The plasma system includes a plasma chamber; an RF driver configured to drive bursts into the plasma chamber with an RF frequency; a nanosecond pulser configured to drive pulses into the plasma chamber with a pulse repetition frequency, the pulse repetition frequency being less than the RF frequency; a high pass filter disposed between the RF driver and the plasma chamber; and a low pass filter disposed between the nanosecond pulser and the plasma chamber.

Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber. One embodiment includes a waveform generator having a voltage source selectively coupled to an output node, where the output node is configured to be coupled to an electrode disposed within a processing chamber, and where the output node is selectively coupled to a ground node. The waveform generator may also include a radio frequency (RF) signal generator, and a first filter coupled between the RF signal generator and the output node.

An LC resonator includes first and second plane electrodes, a first line electrode, a first and second via conductors, and a third plane electrode. The second plane electrode is opposed to at least a portion of the first plane electrode in a specific direction. The first via conductor and the second via conductor extend from the first line electrode in the specific direction to be connected to the first plane electrode and the second plane electrode, respectively. The third plane electrode is opposed to at least a portion of the second plane electrode in the specific direction. The second plane electrode is between the first plane electrode and the third plane electrode in the specific direction.

The invention discloses a power noise suppression circuit applied to a power system. The power noise suppression circuit comprises at least one power noise to heat converter and at least one anti-power noise transmitted unit. When a power noise within a specific frequency band enters the power noise suppression circuit, the power noise to heat converter converts the power noise to a thermal energy, and the anti-power noise transmitted unit reflects the power noise within the specific frequency band to the power noise to heat converter. Accordingly, the power noise within the specific frequency band can be suppressed and absorbed in the power noise suppression circuit, so as to maintain the stability of the power system.

An apparatus for communicating across an isolation barrier includes a differential pair of input terminals. The apparatus includes a bandpass filter circuit configured to receive a received signal on the differential pair of input terminals and to provide a received differential signal on a differential pair of nodes. The apparatus includes a demodulator directly coupled to the bandpass filter circuit and configured to directly demodulate the received differential signal on the differential pair of nodes to provide a demodulated received signal.

An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.