An electronic apparatus includes a base including a surrounding wall defining first and second receiving spaces and having first and second end surfaces, and an electronic module including a terminal unit, and first and second electronic units respectively received in the first and second receiving spaces. The terminal unit includes two first terminals connected to the first electronic unit, two second terminals connected to the second electronic unit, and two connecting terminals, each of which has first and second sections respectively extending from the first and second end surfaces and connected to the first and second electronic units, and an interconnecting section embedded within the base and interconnecting the first and second sections.

First no-electrode-forming areas where first wiring electrodes such as internal wiring electrodes and external connection terminals are not formed are set to ranges that overlap inductor components in a plan view of at least one of dielectric layers of a first substrate, and second no-electrode-forming areas where second wiring electrodes such as internal wiring electrodes and mounting electrodes are not formed are set to ranges that overlaps the inductor components in a plan view of at least one of dielectric layers of a second substrate. Accordingly, reduction of the inductance of the inductor components, which is caused by the first and second wiring electrodes crossing the magnetic field of the inductor components, can be suppressed. Therefore, the overall component size can be reduced without deteriorating the Q value of the inductor components by configuring an RF component with a stacking structure.

An inductor element includes a resin substrate which is an insulating substrate including conductor patterns, and coils defined by the conductor patterns. Two coils are arranged on the same plane, and connected in series. Adjacent coils define a closed magnetic circuit. That is, the winding direction and the connection of the coils are determined such that magnetic flux that interlinks coils that are adjacent in the planar direction define a loop. There are also provided an inductor bridge and a high-frequency filter that include the inductor element.

A multilayer electronic component includes a multilayer body including insulator layers that are stacked, linear conductor traces each provided between adjacent ones of the insulator layers, and via conductors. A helical or substantially helical inductor is provided in the multilayer body. When viewed in the stacking direction of the multilayer body, all of the linear conductor traces, except a portion of one linear conductor trace, are superimposed within an annular or substantially annular linear conductor trace region. The portion of the one linear conductor trace is displaced inwardly from the annular or substantially annular linear conductor trace region.

An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

An electrical power conditioning device for transmitting energy between a source and a load includes an inner conductor that extends within a grounded outer conductor. A low-pass filter extends between the inner and outer conductors and is designed to attenuate high frequency energy transmitted by the inner conductor. The low-pass filter includes at least one capacitor array which comprises multiple capacitor sectors mounted on a common a printed circuit board in a radial arrangement, each sector including a T-shaped configuration of ceramic capacitors to provide operational redundancy. Additionally, a voltage suppressor extends between the inner and outer conductor and suppresses transient voltages transmitted by the inner conductor. The suppressor includes a pair of printed circuit boards between which a plurality of diodes extend in a circular array around the inner conductor, the printed circuit boards electrically connecting the diodes in series to allow for higher overall pulse current capabilities.

An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

A filter includes a first low-pass filter and a second low-pass filter. The first low-pass filter is located at a first channel, and includes a first resistor array coupled with a complex-signal input terminal. The second low-pass filter is located at a second channel, and includes a second resistor array coupled with the complex-signal input terminal. The complex-signal input terminal is configured to provide complex signals to the first channel and the second channel. The filter further includes a third resistor array and a fourth resistor array. The third resistor array is cross-coupled between the first low-pass filter and the second low-pass filter. The fourth resistor array is coupled between the complex-signal input terminal and the third resistor array. The first resistor array, the second resistor array and the fourth resistor array include variable resistors.

An interdigitated RF filter. The interdigitated RF filter includes input fingers connected to an input node and output fingers connected to an output node where at least one input finger is connected the output node or at least one output finger is connected to the input node. The described interdigitated RF filter can be implemented in various configurations such as series, shunt, ladder or a combination thereof.

A multi-mixer system comprising a plurality of mixers and a filter module is provided. Each of the mixers is selectively enabled to mix an input signal with a corresponding oscillation signal to generate an output signal at an output node; and the filter module provides different frequency responses for the output signals from at least two of the output nodes of the mixers, wherein the at least two of the output nodes of the mixers are connected to different internal nodes of the filter module.