A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.

A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.

In one embodiment, an integrated circuit includes: a first radio frequency (RF) circuit configured to receive and process a first RF signal having a sub-gigahertz (GHz) frequency to output a first lower frequency signal and to transmit RF signals having the sub-GHz frequency; a second RF circuit configured to receive and process a second RF signal having a frequency of at least substantially 2.4 GHz to output a second lower frequency signal and to transmit RF signals at the at least substantially 2.4 GHz; shared analog circuitry coupled to the first RF circuit and the second RF circuit, the shared analog circuitry to receive at least one of the first RF signal or the second RF signal and output a digital output signal; and a digital circuit coupled to the shared analog circuit, the digital circuit to recover message information from the digital output signal.

A common line is connected between a common terminal and a common connection node. A first filter has a first pass band. A second filter has a second pass band. At least one of a first condition and a second condition is satisfied. The first condition is that in the first pass band any one of a first impedance of the common line alone viewed from the common terminal (P10) and a second impedance of the first filter viewed from the common connection node includes an inductive property and the other includes a capacitive property. The second condition is that in the second pass band one of the first impedance and a third impedance of the second filter viewed from the common connection node includes an inductive property and the other includes a capacitive property.

A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

An LC filter includes a multilayer body, plate electrodes, capacitor electrodes, and inductor vias. The capacitor electrodes each define a capacitor between the plate electrode and a corresponding one of the capacitor electrodes. A first inductor via is connected between a first capacitor electrode and a first plate electrode. A second inductor via is connected between a second capacitor electrode and the first plate electrode. A third inductor via is connected between a third capacitor electrode and the first plate electrode. A fourth capacitor electrode faces the first and second capacitor electrodes. A fifth capacitor electrode faces the second and third capacitor electrodes. A sixth capacitor electrode faces the first and third capacitor electrodes.

A filter device includes an unbalanced terminal, balanced terminals, and first and second resonant circuits. The first resonant circuit is connected to the unbalanced terminal. The second resonant circuit is connected to the balanced terminals and electromagnetically coupled with the first resonant circuit. The first resonant circuit includes a resonator in which an inductor and a capacitor are connected in parallel between the unbalanced terminal and a reference potential. The second resonant circuit includes a resonator including an inductor connected between the balanced terminals and capacitors connected in series between the balanced terminals.

An electronic component includes a stack and an inductor wound about an axis orthogonal to a stacking direction. The inductor includes a first conductor layer portion and two through hole columns. The first conductor layer portion includes two conductor layers disposed at positions different from each other in the stacking direction and connected in parallel to each other. Area of a first conductor layer is larger than area of a second conductor layer.

An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.

An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a −Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a −X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.