An electronic component includes a stack and first and second inductors. The first inductor includes a first through hole column, a second through hole column, a first conductor layer portion, a second conductor layer portion, and a third conductor layer portion. The second conductor layer portion is connected to an end of the first through hole column and extends close to the second through hole column. The third conductor layer portion is connected to the second through hole column and extends close to the first through hole column.

An LC circuit includes a first capacitor provided between a first connection point and a second connection point, a second capacitor provided between the second connection point and a third connection point, a third capacitor provided between the third connection point and a fourth connection point, a fourth capacitor provided between the first connection point and the third connection point, a fifth capacitor provided between the second connection point and the fourth connection point, a first inductor connected to the second connection point, and a second inductor connected to the third connection point.

A radio-frequency (RF) splitter is provided. The RF splitter includes a common branch node configured to transfer an RF signal, input from an input port, to at least one of first and second output ports, first and second branch nodes electrically connected between the common branch node and the first and second output ports, first and second series switches configured to control switching operations to electrically connect the common branch node and the first and second branch nodes to each other, first and second inductors electrically connected between the common branch node and the first and second branch nodes, a resistor electrically connected between the first and second branch nodes, and first and second shunt switches configured to control switching operations to electrically connect the first and second branch nodes and the resistor to each other.

Systems and methods for duplexer circuits having signal cancellation paths are provided. In one aspect, a duplexer circuit includes a first transmit filter configured to receive a first radio frequency transmit signal from a power amplifier, and a first receive filter configured to receive the first radio frequency transmit signal from the first transmit filter. The circuit also includes a first low-noise amplifier configured to receive the first radio frequency transmit signal from the first receive filter and amplify the first radio frequency transmit signal and a cancellation path configured to receive a second radio frequency transmit signal from the power amplifier. The circuit further includes a phase shifter configured to apply a phase shift to one or both of the first and second radio frequency transmit signals, and a second low-noise amplifier configured to amplify the second radio frequency transmit signal.

A first filter is a hybrid filter including an acoustic wave filter, a plurality of first inductors, and a plurality of first capacitors. A high frequency module further includes a metal electrode layer covering at least part of a resin layer and at least part of an outer peripheral surface of a mounting substrate. Among a plurality of inductors including the plurality of first inductors of the first filter and a plurality of second inductors of a second filter, at least one inductor (the second inductor) is a circuit element including a conductor pattern portion formed in the mounting substrate. The shortest distance between the outer peripheral surface of the mounting substrate and a signal terminal (a third signal terminal) connected to the circuit element is longer than the shortest distance between the outer peripheral surface of the mounting substrate and the circuit element.

Described is an apparatus which comprises: a first transmission path for a first frequency band; a second transmission path for a second frequency band different from the first frequency band; a node common to the first and second transmission paths, the node to be coupled to an antenna; and a transmission-zero circuit coupled to the common node.

In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.

Disclosed is a package for a semiconductor device including a semiconductor die. The package includes a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bonded to the first and second conductive films, respectively. At least one of the first and second portions includes a recess in its back surface facing the base member, and the recess defines a gap between the at least one of the first and second portions below the corresponding conductive film and the base member.

Aspects of this disclosure relate to a multiplexer with a hybrid acoustic passive filter. The multiplexer includes a plurality of filters configured to filter respective radio frequency signals, a shared filter coupled between each of the plurality of filters and a common node, and a radio frequency filter coupled to the common node. At least a first filter of the plurality of filters includes acoustic resonators and a non-acoustic passive component. Related multiplexers, wireless communication devices, and methods are disclosed.

A filter module has a first terminal, a second terminal, and at least one filter disposed along each signal path extending from the first terminal to the second terminal. The filter can include a plurality of series resonators and a plurality of shunt resonators disposed between the series resonators and a ground configured to enhance power ruggedness of the filter module. A matching circuit coupled to the filter performs impedance matching of the filter.