Aspects of this disclosure relate to a multiplexer that includes a switchable acoustic wave filter. The switchable acoustic wave filter can include one or more acoustic wave resonators, switchable acoustic wave resonators, and a switch configurable into at least a first state and a second state. The switch can select a different subset of the switchable acoustic wave resonators to filter a radio frequency signal together with at least the one or more acoustic wave resonators in the first state than in the second state. Related filters, radio frequency systems, wireless communication devices, and methods are also disclosed.

A SAW resonator comprises two reflectors and a transducer arranged between the reflectors. A resonant space between the transducer and a respective reflector is set large enough to enable occurrence of main resonance and at least one further resonance of comparable admittance. Thus, a multiple resonant resonator is achieved that can be used as a parallel resonator in a filter circuit with a DMS track for example to improve attenuation in a stop band.

A high-isolation and anti-glue-invasion Surface Acoustic Wave (SAW) duplexer includes a transmitting filter and a receiving filter. The isolation of the duplexer is improved by adjusting the positions of parallel resonance arms of the receiving filter and optimizing the distances between a grounding metal wiring of a Double Mode Structure (DMS) filter in the receiving filter and other grounding metal wirings and a distance between the grounding metal wiring of the DMS filter in the receiving filter and a signal metal wiring, and the grounding metal wiring is further arranged to surround the series resonance arms and the parallel resonance arms, so as to fill blank positions between the resonance arms and the edge of a package.

An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO.sub.3 and θ is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, θ, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.

An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO.sub.3 and θ is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, θ, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.

An acoustic wave device includes a support substrate including silicon, a piezoelectric layer provided directly or indirectly on the support substrate, and an interdigital transducer (IDT) electrode provided on the piezoelectric layer. When a wavelength defined by an electrode finger pitch of the IDT electrode is λ, a thickness of the piezoelectric layer is about 1λ or less. V.sub.L, which is an acoustic velocity of a longitudinal wave component of a bulk wave propagating through the piezoelectric layer, satisfies Unequal Equation (2) below in relation to an acoustic velocity V.sub.Si-1 determined by Equation (1) below:
V.sub.Si-1=(V.sub.2).sup.1/2 (m/sec)  Equation (1),
V.sub.Si-1≤V.sub.L  Unequal Equation (2), V.sub.2 in Equation (1) is a solution of Equation (3), and
Ax.sup.3+Bx.sup.2+Cx+D=0  Equation (3).

An antenna includes a piezoelectric disc. The antenna further includes a first electrode disposed on a first surface of the piezoelectric disc and a second electrode disposed on a second surface of the piezoelectric disc that is opposite to the first surface. The first electrode and the second electrode are to receive a time-varying voltage to excite a mechanical vibration in the piezoelectric disc, and the piezoelectric disc is to radiate electromagnetic energy at a particular frequency responsive to the mechanical vibration.

When a current flowing in a series circuit including an equivalent resistance, an equivalent inductor, and an equivalent capacitance in an electric equivalent circuit of a specific resonator in each filter is defined as an acoustic path current, under conditions that a phase of an acoustic path current of a first transmission filter at a side of a common terminal at a frequency within a first pass band is represented as θ1.sub.Tx1, a phase of an acoustic path current of the first transmission filter at the side of the common terminal at a frequency within a second pass band is represented as θ2.sub.Tx1, a phase of an acoustic path current of a second transmission filter at the side of the common terminal at a frequency within the first pass band is represented as θ1.sub.Tx2, and a phase of an acoustic path current of the second transmission filter at the side of the common terminal at a frequency within the second pass band is represented as θ2.sub.Tx2, a multiplexer satisfies a first condition: |(2.Math.θ1.sub.Tx1−θ2.sub.Tx1)−(2.Math.θ1.sub.Tx2−θ2.sub.Tx2)|=180°±90°, or a second condition: |(2.Math.θ2.sub.Tx1−θ1.sub.Tx1)−(2.Math.θ2.sub.Tx2−θ1.sub.Tx2)|=180°±90°.

When a current flowing in a series circuit including an equivalent resistance, an equivalent inductor, and an equivalent capacitance in an electric equivalent circuit of a specific resonator in each filter is defined as an acoustic path current, under conditions that a phase of an acoustic path current of a first transmission filter at a side of a common terminal at a frequency within a first pass band is represented as θ1.sub.Tx1, a phase of an acoustic path current of the first transmission filter at the side of the common terminal at a frequency within a second pass band is represented as θ2.sub.Tx1, a phase of an acoustic path current of a second transmission filter at the side of the common terminal at a frequency within the first pass band is represented as θ1.sub.Tx2, and a phase of an acoustic path current of the second transmission filter at the side of the common terminal at a frequency within the second pass band is represented as θ2.sub.Tx2, a multiplexer satisfies a first condition: |(2.Math.θ1.sub.Tx1−θ2.sub.Tx1)−(2.Math.θ1.sub.Tx2−θ2.sub.Tx2)|=180°±90°, or a second condition: |(2.Math.θ2.sub.Tx1−θ1.sub.Tx1)−(2.Math.θ2.sub.Tx2−θ1.sub.Tx2)|=180°±90°.

An elastic wave device manufacturing method includes a preparing a piezoelectric wafer on which IDT electrodes are provided in elastic wave device forming portions, providing on a first main surface of the piezoelectric wafer support layers in the elastic wave device forming portions, bonding a cover member to cover the support layers to obtain a multilayer body, cutting the multilayer body in a first direction multiple times, cutting the multilayer body in a second direction orthogonal to the first direction to obtain elastic wave devices, in which a resin layer extends across a boundary between the elastic wave device forming portions adjacent to each other on the first main surface of the piezoelectric wafer, and the second cutting step is performed in a state in which the resin layer is present.