An acoustic wave device includes a piezoelectric substrate, functional elements, an outer peripheral support layer, a cover portion, and a protective layer covering the cover portion. A hollow space is defined by the piezoelectric substrate, the outer peripheral support layer, and the cover portion, and the functional elements are disposed in the hollow space. The acoustic wave device further includes an under bump metal layer, a wiring pattern, and a through-electrode that connects these elements. In the protective layer, a through-hole to be filled with a conductor to electrically connect a solder ball and the under bump metal layer is provided. The outer peripheral support layer includes a protruding portion protruding to the hollow space. When the acoustic wave device is seen in plan view, at least a portion of the through-hole overlaps the hollow space, and an end portion of the protruding portion overlaps an inner region of the through-hole.

A method of plugging a hydrocarbon well includes deploying a downhole tool to remove at least a portion of a casing at a section of well to be plugged. Deploying a blocking device downhole to block a bottom of the section of well to be plugged. Deploying a plugging material downhole onto the blocking device to fill an area to be plugged. Deploying an exothermic fluid downhole, wherein activation of the exothermic material liquefies the plugging material. Allowing the plugging material and the exothermic fluid to solidify form a cast-in-place plug that fills the section of well to be plugged.

A filter device includes a filter circuit including first and second terminals and series arm resonators along a series arm connecting the first terminal and the second terminal, and an additional circuit connected in parallel at least some of the series arm resonators. The additional circuit includes first, second, and third interdigital transducer electrodes. The first interdigital transducer electrode is connected to a first node at one end portion of a series arm resonator having a lowest anti-resonant frequency of the series arm resonators, the second interdigital transducer electrode is connected to a second node having a potential different from a potential of the first node, the third interdigital transducer electrode is connected to a third node having a potential different from the potentials of the first and second nodes, and the first and second nodes are closer to the first terminal than the third node.

An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity V.sub.si=(V.sub.1).sup.1/2 of propagation through silicon or higher than the acoustic velocity V.sub.si, where V.sub.si is specified by V.sub.1 among solutions V.sub.1, V.sub.2, and V.sub.3 with respect to x derived from Ax.sup.3+Bx.sup.2+Cx+D=0.

An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity V.sub.si=(V.sub.1).sup.1/2 of propagation through silicon or higher than the acoustic velocity V.sub.si, where V.sub.si is specified by V.sub.1 among solutions V.sub.1, V.sub.2, and V.sub.3 with respect to x derived from Ax.sup.3+Bx.sup.2+Cx+D=0.

An elastic wave device includes an LiNbO.sub.3 substrate, a first elastic wave resonator including a first IDT electrode and a first dielectric film, and a second elastic wave resonator including a second IDT electrode and a second dielectric film. A Rayleigh wave travels along at least one surface of the elastic wave device. A thickness of the first dielectric film differs from a thickness of the second dielectric film. A propagation direction of an elastic wave in the first elastic wave resonator coincides with a propagation direction of an elastic wave in the second elastic wave resonator. Euler angles of the LiNbO.sub.3 substrate fall within a range of (0°±5°, θ, 0°±10°).

Aspects of this disclosure relate to an acoustic wave filter that includes a multi-mode surface acoustic wave filter and a ladder section. The multi-mode surface acoustic wave filter has a higher impedance at an output than at an input. The ladder section is connected to the output of the multi-mode surface acoustic wave filter. Related radio frequency systems, radio frequency modules, wireless communication devices, and methods are disclosed.

Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.

A radio frequency module includes a filter that is arranged on a first path connecting a common terminal and a first input/output terminal and has a first frequency band as a pass band, another filter that is arranged on a second path connecting the common terminal and a second input/output terminal and has a second frequency band different from the first frequency band as a pass band, and a detection circuit connected to the first path and configured to detect a leakage signal in the second frequency band leaked to the first path and output a signal indicating a detection result.

A filter device includes a first filter including series resonators and parallel resonators, a first inductor connected in parallel between a first terminal and the first filter, a second inductor provided in series between the first filter and a second terminal, and a third inductor provided in series in a channel connecting the parallel resonator and ground, the third inductor is incorporated in a multilayer substrate, the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip, and the first inductor and the second inductor are chip inductors including coil conductors and are mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes thereof are orthogonal or substantially orthogonal to each other.