This application discloses a chip and a signal level shifter circuit for use on a mobile terminal such as a charger or an adapter. The chip is co-packaged with a first silicon-based driver die and a second silicon-based driver die that are manufactured by using a BCD technology, and a first gallium nitride die and a second gallium nitride die that are manufactured by using a gallium nitride technology. A first silicon-based circuit is integrated on the first silicon-based driver die, a second silicon-based circuit is integrated on the second silicon-based driver die, and a high-voltage resistant gallium nitride circuit is integrated on the first gallium nitride die. In this way, it can be ensured that a second low-voltage silicon-based driver die manufactured by using a low-voltage BCD technology is not damaged by a high input voltage, thereby reducing costs of the chip.

A power gating circuit includes inverters and a voltage divider sub-circuit, a latch comparator, and a gated switch sub-circuit connected to an external power supply circuit of 5V, respectively. The voltage divider sub-circuit is configured to divide a voltage of 5V and output a first voltage and a second voltage to the latch comparator and the gated switch sub-circuit, both voltage values of the first voltage and the second voltage are smaller than a withstand voltage value of a field effect transistor, and the voltage value of the first voltage is greater than that of the second voltage; the latch comparator is configured to compare two signals output by the inverters and latch a comparison result; and the gated switch sub-circuit is further connected with the latch comparator to control an output voltage, thereby improving the stability of the circuit, and extending the using life of the entire circuit.

Techniques are disclosed to allow for a switched capacitor digital power amplifier (PA) that operates using high supply voltage levels beyond twice the maximum voltage rating for any of the transistor terminals such as Vds/Vdg/Vsg.

A voltage tracking circuit includes first, second, third and fourth transistors. The first transistor is in a first well, and includes a first gate, a first drain and a first source coupled to a first voltage supply. The second transistor includes a second gate, a second drain and a second source. The second source is coupled to the first drain. The second gate is coupled to the first gate and the pad voltage terminal. The third transistor includes a third gate, a third drain and a third source. The fourth transistor includes a fourth gate, a fourth drain and a fourth source. The fourth drain is coupled to the third source. The fourth source is coupled to the pad voltage terminal. The fourth transistor is in a second well different from the first well, and is separated from the first well in a first direction.

A level shifter includes a buffer circuit, a first shift circuit, and a second shift circuit. The buffer circuit provides a first signal and a first inverted signal to the first shift circuit, such that the first shift circuit provides a second signal and a second inverted signal to the second shift circuit. The second shift circuit generates a plurality of output signals according to the second signal and the second inverted signal. The first shift circuit includes a plurality of first stacking transistors and a first voltage divider circuit. The first voltage divider circuit is electrically coupled between a first system high voltage terminal and a system low voltage terminal. The first voltage divider circuit is configured to provide a first inner bias to gate terminals of the first stacking transistors.

Techniques and apparatus for driving a transistor gate of a switched-mode power supply (SMPS) circuit. One example gate driver for a switching transistor of an SMPS circuit generally includes a first power supply rail; a reference rail; an output node for coupling to a control input of the switching transistor; a floating supply node; a pulldown transistor having a drain coupled to the output node of the gate driver and having a source coupled to the reference rail; and a pulldown logic buffer having a first power supply input coupled to the floating supply node, having a second power supply input coupled to the reference rail, and having an output coupled to a gate of the pulldown transistor. The floating supply node is configured to selectively receive power from the first power supply rail and the output node of the gate driver.

The present description concerns a method of controlling a bidirectional switch (200), including: first (210 1) and (210 2) field-effect transistors electrically in series between first (262 1) and second (262 2) terminals of the bidirectional switch; third (614) and fourth (612) field-effect transistors electrically in series between said first and second terminals of the bidirectional switch, a first connection node (252) in series with the first and second transistors being common with a second connection node (616) in series with the third and fourth transistors, including steps of: receiving a voltage (V200) between the terminals of the bidirectional switch; detecting, from the received voltage, a first sign of said voltage; at least while the first sign is being detected, coupling the first terminal to said first node (252), potentials of control terminals of the first, second, third, and fourth transistors being referenced to the potential (REF) of the first and second nodes having common sources of the first, second, third, and fourth transistors connected thereto.

Embodiments described herein include radio frequency (RF) switches that may provide increased power handling capability. In general, the embodiments described herein can provide this increased power handling by equalizing the voltages across transistors when the RF switch is open. Specifically, the embodiments described herein can be implemented to equalize the source-drain voltages across each field effect transistor (FET) in a FET stack that occurs when the RF switch is open and not conducting current. This equalization can be provided by using one or more compensation circuits to couple one or more gates and transistor bodies in the FET stack in a way that at least partially compensates for the effects of parasitic leakage currents in the FET stack.

A power converter comprises a switch arrangement for controlling a path of current flow through an energy storage element and power commutation thereof so as to provide an output. The switch arrangement comprises at least first and second MOSFETs connected in series and a controlling circuit for determining how the first and second MOSFETs are switched. The timing of operation of the switching arrangement is used to control the output of the power converter. An adjusting circuit is used to adjust an electrical parameter of a component of the controlling circuit according to an operating condition of the power converter, thereby to control an efficiency of the power converter under different operating conditions.

In an embodiment, a switching circuit is provided that includes a Group III nitride-based semiconductor body including a first monolithically integrated Group III nitride-based transistor device and a second monolithically integrated Group III nitride based transistor device that are coupled to form a half-bridge circuit and are arranged on a common foreign substrate having a common doping level. The switching circuit is configured to operate the half-bridge circuit at a voltage of at least 300 V.