A driver circuit drives an output terminal with an input/output voltage using an NMOS transistor and a PMOS transistor. A pre-driver for the NMOS transistor supplied with a drive voltage and receives a data signal referenced to the drive voltage. A pre-driver for the PMOS transistor has a positive supply input connected to the positive supply rail, a negative supply input receiving a second drive voltage equal to the supply voltage minus the drive voltage. A level shifter circuit, shifts the data signal to be referenced between the supply voltage and the second drive voltage. A charge pump circuit for providing second drive voltage, the charge pump circuit driven with a variable switching frequency proportional to a current of the PMOS transistor.

Switch circuitry is disclosed having a series stack of transistors coupled between first and second port terminals. A string of gate resistors having a common gate terminal is coupled to gates of the series stack of transistors. A bias control transistor has a bias control terminal and first and second current terminals. The second control terminal is coupled to a switch control terminal configured to receive on-state and off-state control voltages that transition the series stack of transistors between passing a radio frequency signal and blocking the radio frequency signal from passing between the first and second port terminals, respectively. A string of diodes is coupled between the common gate terminal and the first current terminal, and a common gate resistor is coupled between the common gate terminal and the switch control terminal. The diodes contribute to actively generating additional negative gate bias as RF power level increases.

Various methods and circuital arrangements for leakage reduction in MOS devices are presented. A pull-up circuit is selectively coupled to a gate of the MOS device to provide control of a voltage to the gate that is larger than a source voltage. Voltage switching circuits selectively couple different voltages to the body and/or back-gate terminals of the MOS device. During a standby mode of operation, the leakage current of the MOS device is decreased by driving the MOS device further into its subthreshold leakage region. During the standby mode, a threshold voltage of the MOS device is increased by coupling a voltage higher than the source voltage to the body and/or back-gate terminals. The MOS device can be a pass device used in low dropout regulator (LDO). During the standby mode, the LDO maintains output regulation by driving the MOS device further into its subthreshold leakage region and/or increasing the threshold voltage.

Disclosed herein are switching or other active FET configurations that implement a branch design with one or more interior FETs of a main path coupled in parallel with one or more auxiliary FETs of an auxiliary path. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of auxiliary FETs coupled in series and a main FET coupled in parallel with an interior FET of the plurality of auxiliary FETs. The body nodes of the FETs can be interconnected and/or connected to a body bias network. The body nodes of the FETs can be connected to body bias networks to enable individual body bias voltages to be used for individual or groups of FETs.

According to the present disclosure, the deterioration of SiC-MOSFETs is suppressed. A drive device switches between a first SiC-MOSFET and a second SiC-MOSFET that are connected in series, with a dead time where the first SiC-MOSFET and the second SiC-MOSFET are commanded to be OFF being provided in between. This drive device includes: a first drive circuit configured to set the gate voltage of the first SiC-MOSFET, during the dead time, to a first middle voltage that is higher than a first negative power supply voltage and lower than a first threshold voltage for the first SiC-MOSFET; and a second drive circuit configured to set the gate voltage of the second SiC-MOSFET, during the dead time, to a second middle voltage that is higher than a second negative power supply voltage and lower than a second threshold voltage for the second SiC-MOSFET.

A bi-directional voltage converter of a smart card includes switching elements connected between an input node and an output node and a start-up transistors whose channel width over channel length is smaller than a channel width over channel length of the switching element. The bi-directional voltage converter stores a driving voltage applied to an output node in a storage capacitor during a booting operation and provides the voltage stored in the storage capacitor to an input node. The bi-directional voltage converter may boost another driving voltage at the input node step-wisely and may perform bi-directional voltage converting with reduced occupied area and high efficiency.

To reduce a leakage current of a transistor so that malfunction of a logic circuit can be suppressed. The logic circuit includes a transistor which includes an oxide semiconductor layer having a function of a channel formation layer and in which an off current is 1×10.sup.−13 A or less per micrometer in channel width. A first signal, a second signal, and a third signal that is a clock signal are input as input signals. A fourth signal and a fifth signal whose voltage states are set in accordance with the first to third signals which have been input are output as output signals.

A semiconductor device includes a first area including a logic circuit, a second area including a functional circuit, a first power line, a second power line that supplies a power to the logic circuit and the functional circuit, and a first power switch circuit connected to the first power line and the second power line, wherein the first power switch circuit includes a first transistor larger than a transistor provided in the logic circuit and being connected to the first power line and the second power line, an end cap provided in an area next to the functional circuit, and a second transistor provided between the end cap and an area including the first transistor, the second transistor being of a same size as the transistor provided in the logic circuit and being connected to the first power line and the second power line.

A snubber circuit includes a snubber substrate including an electrically insulating carrier and an electrically conducting structured layer applied thereon, the electrically conducting structured layer including two segments. The snubber circuit further includes two electrically resistive layers, each resistive layer being applied onto the two segments of the electrically conducting structured layer of the snubber substrate, and a capacitor disposed on the electrically resistive layers and having two terminals, each terminal being electrically connected to one of the electrically resistive layers. Further, a power semiconductor module having such a snubber circuit is disclosed.

Multi-way signal switch designs and methods for reducing parasitic capacitance. In a first embodiment, two or more series-coupled FET shunt-switches are coupled to at least one switch cell through-switch. At least one shunt-switch is set to an OFF state during normal operation so as to function as a capacitor, while at least one other shunt-switch is set to behave like a capacitor in a switch cell ON state, and is set to behave like a resistor in a switch cell OFF state. In a second embodiment, the combination of at least one FET shunt-switch coupled in series with a capacitor functions as a shunt connection for the signal path, wherein the FET shunt-switch is set to behave like a capacitor when the switch cell is in an ON state, and is set to behave like a resistor when the switch cell is in an OFF state.