A memory device is provided. The memory device includes a bit cell having a first invertor connected between a first node and a second node and a second invertor connected between the first node and the second node. The first invertor and the second invertor are cross coupled at a first data node and a second data node. The memory device further includes a pull down circuit connected to the second node. The pull down circuit is operative to pull down a voltage of the second node below a ground voltage in response to an enable signal.

Aspects of the disclosure provide for a circuit. In some examples, the circuit includes a first transistor, a second transistor, a third transistor, a first capacitor, and a second capacitor. The first transistor comprises a drain terminal coupled to an input voltage node, a source terminal coupled to a first node, and a gate terminal coupled to a second node. The second transistor comprises a drain terminal coupled to a third node, a source terminal coupled to a fourth node, and a gate terminal coupled to a fifth node. The third transistor comprises a drain terminal coupled to a sixth node, a source terminal configured to couple to a gate terminal of a switching transistor, and a gate terminal coupled to a seventh node. The first capacitor is coupled between the first node and the third node. The second capacitor is coupled between the fourth node and the sixth node.

An off chip driver circuit includes a pull-up circuit and a pull-down circuit. The pull-up circuit includes several first transistors and a first resistance circuit coupled between the first transistors and a input/output pad. The first transistors generate a first voltage to the first resistance circuit. The first resistance circuit transmits, in response to a first control signal, the first voltage to the input/output pad and to have a variable resistance according to the first control signal. The pull-down circuit includes several second transistors and a second resistance circuit coupled between the second transistors and the input/output pad. The second transistors generate a second voltage to the second resistance circuit. The second resistance circuit transmits, in response to a second control signal, the second voltage to the input/output pad and to have a variable resistance according to the second control signal.

A power domain change circuit includes an input circuit and an output circuit. The input circuit is suitable for operating in a first power domain and generating first and second intermediate processing signals. The output circuit is suitable for operating in a second power domain and generating a final output signal by averaging and combining transition jitter components of the first and second intermediate processing signals.

A memory device as provided may apply a pulse amplitude modulation method to data (DQ) signal transmission/reception and may scale a DQ signal according to an operating frequency condition, so as to improve data transmission performance and effectively improve power consumption. The memory device includes a memory cell array, and a data input/output circuit configured to scale a DQ signal that includes data read from the memory cell array and output the scaled DQ signal. The data input/output circuit is configured to scale the DQ signal based on an n-level pulse amplitude modulation (PAMn) (where n is 4 or a greater integer) with a DQ parameter that corresponds an operating frequency condition and output the DQ signal. Other aspects include memory controllers that communicate with the memory devices, and memory systems that include the memory devices and memory controllers.

A non-volatile memory device, including a non-volatile memory cell array, a sense amplifier, a random access memory (RAM), and a buffer circuit, is provided. The sense amplifier is configured to generate readout data. The RAM is configured to store write-in data. The buffer circuit generates a detection result according to target data and the readout data, and writes the detection result to the RAM.

The present application discloses a dual-port SRAM having two ports. On a layout, pass gates connecting to the two ports are disposed near pull down transistors of corresponding memory nodes. A cell layout structure of the SRAM cell structure is centrosymmetric. In a first subunit layout structure, a pass gate and a first pull down transistor share the same active region, and an active region of the other pull down transistor is disposed between active regions of the first pull down transistor and a first pull up transistor. The present application improves the symmetry of read paths of the two memory nodes from two ports thus the symmetry of read currents, therefore the variation of the electrical performance of PMOS transistors is reduced and the stability of the electrical performance of the PMOS transistors is improved.

A bit line sense amplifier includes: a first inverter having an input terminal connected to a first sensing node and an output terminal connected to a second inner bit line; a second inverter having an input terminal connected to a second sensing node and an output terminal connected to a first inner bit line; a first capacitor connected between the first sensing node and the first inner bit line; a second capacitor connected between the second sensing node and the second inner bit line; an isolation unit configured to cut off a connection between the first inner bit line and a second bit line; and an offset cancellation unit configured to connect the first sensing node to the second inner bit line, the first inner bit line to the first bit line, the second sensing node to the first inner bit line, and the second inner bit line to the second bit line.

A bootstrapped switch includes a first transistor, a second transistor, a first capacitor, three switches, and a switch circuit. The switch circuit includes a first switch, a second switch, a second capacitor, and a resistor. The first transistor receives the input voltage and outputs the output voltage. The first terminal of the second transistor receives the input voltage, and the second terminal of the second transistor is coupled to the first terminal of the first capacitor. The control terminal of the first switch receives a clock. The second switch is coupled between the control terminal of the first transistor and the first switch. The second capacitor is coupled between the control terminal of the first switch and the control terminal of the second switch. The resistor is coupled between the control terminal of the second switch and a reference voltage.

Aspects of the invention include a first pull-down device and a second pull-down device, wherein a first drain terminal is connected to a second source terminal, and wherein a first gate terminal is connected to a true read local bitline, wherein a second drain terminal is connected to a compliment read local bit line, and wherein a second gate terminal is connected to a true write global bitline, a third pull-down device and a fourth pull-down device, wherein a third source terminal is connected to the voltage supply, wherein a third drain terminal is connected to a fourth source terminal, and wherein a third gate terminal is connected to the compliment read local bitline, and wherein a fourth drain terminal is connected to the true read local bitline, and wherein a fourth gate terminal is connected to a compliment write global bit line.