The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

An oscillator includes a first package, an oscillation element housed in the first package, a first temperature controller housed in the first package, a second package adapted to house the first package, and a second temperature controller disposed outside the first package, and housed in the second package.

An oscillator includes a first package, an oscillation element housed in the first package, a first temperature controller housed in the first package, a second package adapted to house the first package, and a second temperature controller disposed outside the first package, and housed in the second package.

An oscillator includes: a resonator; an oscillation circuit configured to oscillate the resonator; a first temperature compensation circuit configured to perform a first temperature compensation processing of temperature-compensating for a frequency of a first clock signal generated by oscillation of the resonator by the oscillation circuit; and a second temperature compensation circuit configured to receive the first clock signal subjected to the first temperature compensation processing, and to output a second clock signal subjected to a second temperature compensation processing based on the first clock signal. The first temperature compensation circuit is configured to perform a first-order first temperature compensation processing as the first temperature compensation processing. The second temperature compensation circuit is configured to perform a high-order second temperature compensation processing as the second temperature compensation processing.

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

Provided is a thermostatic type crystal oscillator with short operation stabilization time and low power consumption.

A thermostatic type crystal oscillator according to the present invention includes a crystal resonator including an IT-cut crystal blank, a vibration control circuit configured to control a vibration frequency of the crystal resonator, a temperature regulator configured to regulate a temperature of the crystal resonator within a set temperature range by repeating heating and cooling to the crystal resonator, a heat conducting plate configured to function as a heat absorbing plate and a heat dissipating plate for the temperature regulator, a temperature control circuit configured to control a temperature of the temperature regulator, and a housing that accommodates the crystal resonator. The housing defines a resonator accommodating space in which the crystal resonator is accommodated inside the housing.

Provided is a thermostatic type crystal oscillator with short operation stabilization time and low power consumption.

A thermostatic type crystal oscillator according to the present invention includes a crystal resonator including an IT-cut crystal blank, a vibration control circuit configured to control a vibration frequency of the crystal resonator, a temperature regulator configured to regulate a temperature of the crystal resonator within a set temperature range by repeating heating and cooling to the crystal resonator, a heat conducting plate configured to function as a heat absorbing plate and a heat dissipating plate for the temperature regulator, a temperature control circuit configured to control a temperature of the temperature regulator, and a housing that accommodates the crystal resonator. The housing defines a resonator accommodating space in which the crystal resonator is accommodated inside the housing.

There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.