There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.

A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1<Dbx1, a distance between the output buffer circuit and one of the through electrodes is Dbx1, a distance between the temperature sensor circuit and the other through electrode is Dsx1.

A crystal oscillator includes a quartz crystal piece, a semiconductor chip, and a temperature sensor. The semiconductor chip includes an oscillator circuit to cause the quartz crystal piece to oscillate and a first bump. The first bump is connected to the oscillator circuit and disposed on a surface on a side of the quartz crystal piece. The temperature sensor is bonded to the first bump.

A circuit device includes a phase comparator that performs phase comparison between an input signal based on an oscillation signal and a reference signal, a processor that performs a signal process, and an oscillation signal generation circuit that generates the oscillation signal having an oscillation frequency which is set on the basis of frequency control data from the processor. The circuit device also includes at least one of a first register that stores phase comparison result data, a second register in which one of offset adjustment data for GPS and offset adjustment data for UTC is set, and a third register in which offset adjustment data for adjusting a phase difference is set.

A quantum interference device includes an atomic cell, a light source, a light detector, a package, and a reflective portion. The atomic cell has alkali metal atoms disposed within, and the light source emits light to excite the alkali metal atoms in the atomic cell. The light detector detects light transmitted through the atomic cell. The package defines an internal space and houses at least the light source. The reflective portion is provided between an inner surface of the package and the light source, and has reflectance to an electromagnetic wave having a wavelength of 4 μm, where the reflectance is greater than or equal to 50%.

A quantum interference device includes an atomic cell, a light source, a light detector, a package, and a reflective portion. The atomic cell has alkali metal atoms disposed within, and the light source emits light to excite the alkali metal atoms in the atomic cell. The light detector detects light transmitted through the atomic cell. The package defines an internal space and houses at least the light source. The reflective portion is provided between an inner surface of the package and the light source, and has reflectance to an electromagnetic wave having a wavelength of 4 μm, where the reflectance is greater than or equal to 50%.

A device cover for temperature control of a component device includes at least one heating element enclosed using the device cover, and multiple sections. Each section is located at a distinct location on the device cover and includes a reflection angle for the distinct location. The reflection angle is configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element.

An oven controlled crystal oscillator includes a crystal oscillator, a temperature control circuit, and a control integrated circuit. The crystal oscillator includes a crystal resonator and an oscillator circuit. The temperature control circuit includes a heater resistor, a thermistor, a first resistor, a second resistor, a third resistor, a differential amplifier, a thermosensor, and a fourth resistor. The thermosensor is disposed in parallel to the first resistor. The thermosensor has one end to which the supply voltage is supplied. The fourth resistor has one end connected to another end of the thermosensor and another end that is grounded. The control integrated circuit includes a digital variable resistor and a controller. The digital variable resistor is connected to the thermosensor in parallel. The controller adjusts a resistance value of the digital variable resistor based on a digital control signal input from outside.

A temperature-controlled RF resonator. The resonator includes an insulating thermal enclosure within which are implemented: at least one resonant element configured to deliver an RF output signal when supplied with an RF input signal; at least one heating element configured to supply thermal energy within the thermal enclosure when the at least one heating element is powered by an LF electric power signal; and at least one temperature sensor configured to deliver an LF electric measurement signal as a function of the temperature inside the thermal enclosure. Such an RF resonator has at least one input/output port crossing the insulating thermal enclosure and propagating at least: one signal from among the RF signals; and another signal from among the LF electric signals.

An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.