A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and in a case of varying temperature in a temperature range of ±5° C. centered on a reference temperature in intervals of 6 minutes, and assuming observation period as τ, a wander performance fulfills a condition that an MTIE value is equal to or shorter than 6 ns in a range of 0 s<τ≦0.1 s, the MTIE value is equal to or shorter than 27 ns in a range of 0.1 s<τ≦1 s, the MTIE value is equal to or shorter than 250 ns in a range of 1 s<τ≦10 s, the MTIE value is equal to or shorter than 100 ns in a range of 10 s<τ≦1700 s, and the MTIE value is equal to or shorter than 6332 ns in a range of 100 s<τ≦1000 s.

A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and in a case of varying temperature in a temperature range of ±5° C. centered on a reference temperature in intervals of 6 minutes, and assuming observation period as τ, a wander performance fulfills a condition that an MTIE value is equal to or shorter than 6 ns in a range of 0 s<τ≦0.1 s, the MTIE value is equal to or shorter than 27 ns in a range of 0.1 s<τ≦1 s, the MTIE value is equal to or shorter than 250 ns in a range of 1 s<τ≦10 s, the MTIE value is equal to or shorter than 100 ns in a range of 10 s<τ≦1700 s, and the MTIE value is equal to or shorter than 6332 ns in a range of 100 s<τ≦1000 s.

A ring oscillator circuit includes a plurality of first delay circuits each including X first delay elements, and a second delay circuit including a plurality of second delay elements different in delay amount from each other arranged in parallel to each other so as to be alternatively loaded, the plurality of first delay circuits and the second delay circuit are configured to be connected to each other in a ring-like manner, and X is an integer fulfilling X≧1.

A ring oscillator circuit includes a plurality of first delay circuits each including X first delay elements, and a second delay circuit including a plurality of second delay elements different in delay amount from each other arranged in parallel to each other so as to be alternatively loaded, the plurality of first delay circuits and the second delay circuit are configured to be connected to each other in a ring-like manner, and X is an integer fulfilling X≧1.

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

A clock oscillator includes a first resonator, a second resonator, and a frequency synthesis module, where an output frequency of the first resonator is higher than an output frequency of the second resonator, the frequency synthesis module is configured to generate a synthesis frequency based on the output frequency of the first resonator and the output frequency of the second resonator, and the synthesis frequency is used as a clock frequency output by the clock oscillator. The clock oscillator uses both of the two resonators with the different output frequencies as clock signal sources, and generates a synthesized clock signal by using the frequency synthesis module.

A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1<Dbx1, a distance between the output buffer circuit and one of the through electrodes is Dbx1, a distance between the temperature sensor circuit and the other through electrode is Dsx1.