Provided is a waterproof structure to prevent water ingress through an air hole in a casing of a communication device. A waterproof structure for a communication device, the communication device including a casing that houses an electronic substrate and has an air hole, includes a plate member facing the casing and attached to the casing such that the plate member covers the air hole, and a sealing member interposed between the plate member and the casing to prevent ingress of water into the air hole through a gap between the plate member and the casing.

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

A radio frequency module includes a module substrate including major surfaces that face each other; a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed; a second base part that is at least partially comprised of a second semiconductor material having a thermal conductivity lower than the thermal conductivity of the first semiconductor material and in which an amplifier circuit is formed; and an external connection terminal disposed on or over the major surface. The first base part and the second base part are disposed on or over the major surface out of the major surfaces; and the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode.

A radio frequency module includes a module substrate including major surfaces that face each other; a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed; a second base part that is at least partially comprised of a second semiconductor material having a thermal conductivity lower than the thermal conductivity of the first semiconductor material and in which an amplifier circuit is formed; and an external connection terminal disposed on or over the major surface. The first base part and the second base part are disposed on or over the major surface out of the major surfaces; and the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode.

Disclosed herein is a case for a portable electronic device. The case has a back wall and a plurality of side walls for retaining the portable electronic device. The back wall includes a storage area. A cover is hingedly attached to the back wall to selectively cover the storage area. The storage area includes a grip for retaining edges of data cards.

Disclosed herein is a case for a portable electronic device. The case has a back wall and a plurality of side walls for retaining the portable electronic device. The back wall includes a storage area. A cover is hingedly attached to the back wall to selectively cover the storage area. The storage area includes a grip for retaining edges of data cards.

A connecting member in a radio control transmitter for transmitting a control signal to a control target by controlling an operating portion detachably attached to a main body is provided. The connecting member is disposed between the main body and the operating portion to randomly set a position of the operating portion with respect to the main body, wherein the connecting member has outer fitting holes arranged along a circumference of a large diameter and inner fitting holes arranged along a circumference of a small diameter to be concentric with arrangement of the outer fitting holes.

A wireless transmission module, chips, a passive component, and a coil are integrated into an integral structure, so that an integration level of the wireless transmission module is improved. In addition, the integral structure can effectively implement independence of the module, and the independent module can be flexibly arranged inside structural design of an electronic device, and does not need to be disposed on a mainboard of the electronic device. Only an input terminal of the wireless transmission module needs to be retained on the mainboard of the electronic device. In addition, the integral structure can further effectively increase a capability of a product for working continuously and normally in an extremely harsh scenario, and improve product reliability. In addition, in the structure of the wireless transmission module, the chips and the coil are integrated, and signal transmission paths between the chips and the coil are relatively short.

The invention relates to the field of accessories for mobile electronic devices, in particular to multifunctional cases for mobile electronic devices: phones, tablets, etc., and can be used for heating the mobile electronic devices in the cold season. The invention provides an increase in the efficiency of heating by increasing the heating rate and the possibility of smooth control of the heating temperature. A case for a mobile electronic device, the case having a heating and charging function, the case comprising a body, a power source disposed in the body; a microcontroller disposed in the body; a heating element disposed in the body and coupled with the power source and the microcontroller, and at least one means of communication with the mobile electronic device, characterized in that the microcontroller comprises a means for generating pulse-width modulation, wherein the heating element is coupled with the power source via a bridge circuit including two pairs of semiconductor switches, and the microcontroller is coupled with the bridge circuit and the heating element via two control semiconductor switches, each of which is related with one pair of switches of the bridge circuit.