Patent classifications
H04B1/03
Radio-frequency switching apparatus
A radio-frequency switching apparatus that can be used to turn a signal path on or off or to attenuate a radio-frequency signal. The switching apparatus comprises at least one radio-frequency input, at least one radio-frequency output, at least one transmission line providing a signal path between the at least one radio-frequency input and the at least one radio-frequency output, and at least one transition metal oxide portion. The radio-frequency switching apparatus also comprises direct current blocking means electrically coupled between the at least one transition metal portion and the at least one radio-frequency input. The radio-frequency switching apparatus also comprises biasing means for providing a bias across the at least one transition metal oxide portion such that power transferred between the radio-frequency input and the radio-frequency output is controlled by controlling the bias level across the at least one transition metal oxide portion.
Electronic devices including laser-textured glass cover members
A laser-textured glass cover member suitable for use in an electronic device is disclosed. The laser-textured surface of the glass cover member may provide a smooth feel to an external surface of the electronic device without introducing a perceptible visual texture. Methods for making the laser-textured glass cover members are also disclosed.
TRANSCUTANEOUS ANALYTE SENSOR
The present invention relates generally to systems and methods for measuring an analyte in a host. More particularly, the present invention relates to systems and methods for transcutaneous measurement of glucose in a host.
DATA PROCESSING SYSTEM CAPABLE OF OPTIMIZING MULTIPLE ANTENNAS
A data processing system includes a display device, a proximity sensor, a wireless data processing apparatus, and an external antenna. The display device and the wireless data processing apparatus are connected. The display device is equipped with an internal antenna indirectly connected to a wireless communication module of the wireless data processing apparatus. The external antenna is electrically connected to the wireless communication module. A data processing circuit of the wireless data processing apparatus normally controls the wireless communication module to set signal transmission strengths of the antennas by using a first antenna control mode. When the proximity sensor detects an object located close to proximity sensor, the data processing circuit controls the wireless communication module to set the signal transmission strengths by using a second antenna control mode that includes at least decreasing the signal transmission strength of the internal antenna.
MANUFACTURING METHOD OF ELECTRONIC DEVICE
The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.
MANUFACTURING METHOD OF ELECTRONIC DEVICE
The disclosure provides a manufacturing method of an electronic device. The manufacturing method of the electronic device includes steps as follows. A substrate is provided. A first opening is formed and penetrates the substrate. A polymer layer is formed in the first opening. The polymer layer is in contact with a sidewall of the substrate at the first opening.
Electronic device enclosure having a textured glass component
Textured cover assemblies for electronic devices are disclosed. The textured cover assemblies may provide a combination of optical and tactile properties to the electronic devices. In some cases, a textured cover assembly may be provided over decorative coating.
Launcher of electromagnetic surface wave propagating along seawater-air or ground-air interface
A surface wave launcher surrounds and provides structure complimentary to an antenna and converts (transforms) a near field produced by the antenna into a cylindrical surface wave structure with a strong electric or magnetic field component parallel to a launching interface and propagating two-dimensionally from the launcher. The surface wave launcher leverages the interface found along ocean-air or ground-air to increase a field strength transmitted for a given antenna size and power available. The surface wave launcher maintains a relatively small structure compared to wavelength offering mobility to a very low frequency transmitter. Due to localization of the surface wave energy near the interface, communications using the surface wave retain a desirable low probability of detection.
Launcher of electromagnetic surface wave propagating along seawater-air or ground-air interface
A surface wave launcher surrounds and provides structure complimentary to an antenna and converts (transforms) a near field produced by the antenna into a cylindrical surface wave structure with a strong electric or magnetic field component parallel to a launching interface and propagating two-dimensionally from the launcher. The surface wave launcher leverages the interface found along ocean-air or ground-air to increase a field strength transmitted for a given antenna size and power available. The surface wave launcher maintains a relatively small structure compared to wavelength offering mobility to a very low frequency transmitter. Due to localization of the surface wave energy near the interface, communications using the surface wave retain a desirable low probability of detection.
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
To achieve miniaturization, a high-frequency module includes a mounting substrate, a power amplifier, and an electronic component. The mounting substrate has a first main surface and a second main surface on opposite sides. The power amplifier is arranged on a mounting substrate. The power amplifier has a driver stage amplifier and an output stage amplifier. The driver stage amplifier is arranged on the second main surface of the mounting substrate. The output stage amplifier is arranged on the first main surface of the mounting substrate. The electronic component is arranged on the first main surface of the mounting substrate. The electronic component overlaps the driver stage amplifier in a plan view from a thickness direction of the mounting substrate.