Patent classifications
H04B3/46
Manufacturing method of electronic device and electronic device
A manufacturing method of an electronic device and an electronic device are provided. The manufacturing method includes the following steps: providing a substrate; forming a plurality of signal lines and a testing circuit on the substrate, wherein the testing circuit includes a plurality of output channels electrically connected to at least a portion of the plurality of signal lines; performing a testing process; and optionally isolating the testing circuit from the at least a portion of the plurality of signal lines. The testing process includes: providing a signal; processing a plurality of testing signals by processing the signal via the testing circuit; and transmitting the plurality of testing signals to the at least a portion of the plurality of signal lines via the plurality of output channels. The plurality of output channels are less than the plurality of signal lines in quantity.
Manufacturing method of electronic device and electronic device
A manufacturing method of an electronic device and an electronic device are provided. The manufacturing method includes the following steps: providing a substrate; forming a plurality of signal lines and a testing circuit on the substrate, wherein the testing circuit includes a plurality of output channels electrically connected to at least a portion of the plurality of signal lines; performing a testing process; and optionally isolating the testing circuit from the at least a portion of the plurality of signal lines. The testing process includes: providing a signal; processing a plurality of testing signals by processing the signal via the testing circuit; and transmitting the plurality of testing signals to the at least a portion of the plurality of signal lines via the plurality of output channels. The plurality of output channels are less than the plurality of signal lines in quantity.
Power cords that measure and report electrical energy consumption, and related hardwired apparatuses and methods
Power cords are provided. A power cord includes measurement circuitry configured to measure electrical energy consumption by an apparatus that is connected to the power cord. The power cord also includes first transceiver circuitry configured to transmit data regarding the measured electrical energy consumption to second transceiver circuitry that is spaced apart from the power cord. Related hardwired apparatuses and methods are also provided.
Power cords that measure and report electrical energy consumption, and related hardwired apparatuses and methods
Power cords are provided. A power cord includes measurement circuitry configured to measure electrical energy consumption by an apparatus that is connected to the power cord. The power cord also includes first transceiver circuitry configured to transmit data regarding the measured electrical energy consumption to second transceiver circuitry that is spaced apart from the power cord. Related hardwired apparatuses and methods are also provided.
HIGH-SPEED SIGNAL SUBSYSTEM TESTING SYSTEM
A high-speed signal subsystem testing system includes a processing system having a transmitter and a receiver, a loop back subsystem coupled to the transmitter and receiver to provide a testing communication path between the transmitter and the receiver, and a communication path testing engine coupled to the transmitter and the receiver. The communication path testing engine generates test signal(s) and transmits the test signal(s) via the transmitter and through the testing communication path provided by the loop back subsystem and, in response, receives test signal result(s) via the receiver and through the testing communication path provided by the loop back subsystem, The communication path testing engine processes the test signal result(s) to generate a testing impedance profile for the testing communication path, and compares the testing impedance profile to an expected impedance profile to determine whether a testing communication path issue exists in the testing communication path.
Perceptible indicators of wires being attached correctly to controller
Tools and techniques are described to automate line testing when wiring devices (such as equipment and sensors) to controllers. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. After testing, a reporting device rapidly shows the results of the line testing.
Perceptible indicators of wires being attached correctly to controller
Tools and techniques are described to automate line testing when wiring devices (such as equipment and sensors) to controllers. Controllers have access to databases of the devices that are controlled by them, including wiring diagrams and protocols, such that the controller can automatically check that each wire responds correctly to stimulus from the controller. After testing, a reporting device rapidly shows the results of the line testing.
Communication circuit, communication control method, circuit board, and air conditioning system
A communication circuit includes first and second communication nodes including first and second control chips, respectively, and first and second communication chips connected to the first and second control chips, respectively. The first and second communication chips are connected to each other through first and second signal lines, and are configured to transmit a differential signal. The first communication chip includes an output port to output a level signal obtained from the differential signal to the first control chip. The communication circuit further includes a voltage division assembly connected to the first and second signal lines, and configured to cause a voltage value of the first signal line to be higher than that of the second signal line when the first and second signal lines are in idle state. The first control chip includes a detection port connected to the output port to acquire the level signal.
Communication circuit, communication control method, circuit board, and air conditioning system
A communication circuit includes first and second communication nodes including first and second control chips, respectively, and first and second communication chips connected to the first and second control chips, respectively. The first and second communication chips are connected to each other through first and second signal lines, and are configured to transmit a differential signal. The first communication chip includes an output port to output a level signal obtained from the differential signal to the first control chip. The communication circuit further includes a voltage division assembly connected to the first and second signal lines, and configured to cause a voltage value of the first signal line to be higher than that of the second signal line when the first and second signal lines are in idle state. The first control chip includes a detection port connected to the output port to acquire the level signal.
SIGNAL TRANSMISSION DEVICE AND SIGNAL TRANSMISSION SYSTEM
A signal transmission device includes a communication unit that is connected to an electronic device by a signal wiring and performs communication with the electronic device via the signal wiring, a signal processing unit that performs signal processing related to the communication, a power supply unit that supplies direct current to the electronic device via the signal wiring, and a filter circuit connected between the signal wiring and the power supply unit. The filter circuit includes a plurality of filters having frequency characteristics different from each other, and the signal processing unit acquires communication quality information indicating quality of the communication in at least two or more frequency bands, and determines a state of the filter circuit based on the communication quality information.