A method of manufacturing a device with a optical component disposed thereon, including following steps of: preparing a substrate, the substrate including a signal guide and an electric conductive structure; and mounting an optical component on the substrate and corresponding a light transmission face of the optical component to the signal guide, wherein the optical component and the substrate is connected by an adhesive material and the optical component is electrically connected with the electric conductive structure. A transmission device being made by the method of manufacturing the device with the optical component disposed thereon as described above is further provided.

Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The first substrate and the second substrate may be lattice-matched such that an interface region between the first substrate and the second substrate exhibits an sp3 carbon peak at about 1332 cm.Math..sup.1 having a full width half maximum of no more than 5.0 cm.Math..sup.1 as measured by Raman spectroscopy. In some aspects, the first substrate and said second substrate permit said chip to transmit or receive data at a transfer rate of at least 500 megabits per second and a frequency of at least 8 GHz. In some aspects, the RF amplifier chip is part of a satellite transmitter.

Disclosed herein are methods, devices, and system for beam forming and beam steering within ultra-wideband, wireless optical communication devices and systems. According to one embodiment, a free space optical (FSO) communication apparatus is disclosed. The FSO communication apparatus includes a semiconductor optical device configured to have a transient response time of less than 500 picoseconds (ps), a lens, and a first band select filter.

A data storage device is involved in data storage technology. The data storage device of present invention includes a data memory which is placed in a hermetic housing, a power interface of the data memory which is connected to the wireless power transmission unit, and a data transmission interface of the data memory which is connected to the wireless data transmission unit. The wireless power transmission unit and the data transmission unit are placed in the housing. The present invention avoids the damage to the data memory due to the oxidation of the internal conductors.

Transmit-side equalization is disclosed for network devices and network communications methods employing onboard/co-packaged optics. An illustrative network device includes a substrate having a host device IC (integrated circuit) and an optical module IC connected by a short-reach link. The optical module IC having a transmit chain includes a CTLE (continuous time linear equalizer) to at least partly compensate for a channel response of the short-reach link, and a driver that amplifies an output of the CTLE for a photoemitter that couples to an optical fiber. The host device IC includes: a parallel-to-serial converter that produces a digital symbol stream; a digital to analog converter that supplies an analog signal to the short-reach link; and a pre-equalizer coupling the parallel-to-serial converter to the digital-to-analog converter, the pre-equalizer filtering the digital symbol stream to at least partly compensate for a channel response of a combined channel that includes the short-reach link, the CTLE, the driver, and the photoemitter.

Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.

An optical wireless communication device comprises: at least one of a transmitter and a receiver configured to transmit and/or receive light comprising an optical wireless communication signal representing data; at least one adjustable shutter element associated with the at least one of a transmitter and a receiver, wherein the at least one adjustable shutter element and the associated at least one of the transmitter and the receiver are adjustable between a first configuration and a second configuration such that in the first configuration the at least one adjustable shutter element is configured to at least partially block or partially redirect light having a first selected property and at least partially allow light having a second selected property to pass through unaffected such that transmission and/or reception of the optical wireless communication signal by the at least one of the transmitter and the receiver is substantially altered.

Provided is an optical modulating device including a substrate including first and second trenches, a phase modulator in a region of the substrate, the phase modulator including an undoped region provided between the first and the second trenches, and first and a second doped regions which are apart from each other with the undoped region therebetween, wherein the phase modulator is configured to modulate a phase of light traveling through the undoped region based on a first electrical signal applied to the phase modulator, an amplifier including a first doped layer, a quantum well layer, a clad layer, and a second doped layer sequentially on the substrate, the amplifier overlapping at least a portion of the phase modulator and being configured to amplify the light based on a second electrical signal applied to the amplifier, and an insulating layer between the phase modulator and the amplifier.

An optical transmission module includes a metal base including a signal terminal which extends along a first direction, a dielectric block including a dielectric substance, the dielectric block having a semiconductor plane, an optical plane, and a thermal plane, the semiconductor plane and the optical plane being parallel to the first direction, the thermal plane crossing the first direction, and the semiconductor plane being provided between the optical plane and the thermal plane in the first direction, an optical semiconductor element mounted on the semiconductor plane, the optical semiconductor element being electrically connected with the signal terminal, a temperature regulating element provided between the dielectric block and the metal base in the first direction, the temperature regulating element being contacted with the thermal plane, and a lens mounted on the optical plane.

A plurality of electromagnetic radiation capture units are positioned under a focusing unit such as a dome, such that incoming electromagnetic radiation incident on the dome is deflected by it, to reach each of the capture units with a different timing and intensity. The profile for the timings and intensities can be determined for a given transmitter using a calibration signal, and the profile is then used to extra data from data signals transmitted by the transmitter.