An adjustable micro-optoelectronic system supporting bidirectional transmission, an online upgrade, and online configuration. The system includes: a substrate; and edge connectors, a clock-and-data recovery (CDR) chip for transmitting, a CDR chip for receiving, a microprocessor, and an internal optical system, which are provided on the substrate. The edge connectors serve as an interface of a high-speed electrical signal, and are configured to exchange information between the micro-optoelectronic system and an external environment. The internal optical system is configured to transmit and receive an optical signal. A link for the high-speed electrical signal is connected among the edge connectors, the CDR chip for transmitting, the internal optical system, and the CDR chip for receiving. A communication connection is provided between the microprocessor and each of the edge connectors, the CDR chip for transmitting, the CDR chip for receiving, and the internal optical system.

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

According to an example, a transmitter transmits a plurality of optical signals of multiple wavelengths via an optical link to a receiver. An optical link tuner coupled to the optical link groups the plurality of optical signals into a first group of optical signals and a second group of optical signals, where the first group of optical signals has a first wavelength range and the second group of optical signals has a second wavelength range. The optical link tuner adjusts link tuning parameters associated with the first group of optical signals during a first phase, such that the second group of optical signals is propagated to the receiver without modifications to link tuning parameters associated with the second group, where during the first phase the receiver is to detect unplugging of the optical link based on the second group of optical signals.

An image transmission system is disclosed. The image transmission system includes at least one image capturing device, at least one conversion device, at least one image processor, and at least one flexible printed circuit (FPC). The at least one FPC includes at least one conductive layer and at least one optical waveguide layer. The at least one image capturing device is configured to capture at least one data. The at least one conversion device is configured to perform a conversion between the at least one data and an optical signal. The at least one image processor is configured to obtain the at least one data according to the optical signal, and processes the data. The at least one optical waveguide layer is configured to transmit the optical signal.

The present invention relates to a fiber branch structure for spatial optical communication for transmitting information by emitting communication light. The fiber branch structure is provided with: a light emitter configured to emit communication light; a light emission controller configured to control the light emitter; an optical fiber configured to transmit the light emitted from the light emitter; a distributor configured to distribute the light, the distributer being optically coupled to an output terminal of the optical fiber; and an optical fiber group optically coupled to a plurality of output terminals of the distributor. According to the present invention, a communication area can be established without blind spots. That is, the fiber branch structure for spatial optical communication according to the present invention includes an optical fiber group optically coupled to a plurality of output terminals of the distributor. A communication area can be established more assuredly by such an optical fiber group, which prevents the optical communication from being interrupted.

Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.

An apparatus comprising a chip comprising a plurality of micro-emitters, the micro-emitters to couple to a plurality of data lines and to an optical fiber, wherein the micro-emitters are to generate optical signals for parallel transmission through the optical fiber, the optical signals corresponding to data communicated on the data lines.

An optical link system for computation, preferably including a photonics substrate and a plurality of electronics modules, such as processors, memory controllers, and/or switches, which are preferably bonded to the photonics substrate. A photonics substrate, preferably including a plurality of optical links including waveguides and optical transducers. A method for optical link system operation, preferably including operating electronics modules and using optical links, optionally in cooperation with electronics modules such as switches, to transfer information between the electronics modules.

The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (A.sub.oC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (E.sub.oK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (S.sub.o) to be coupled in.

Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.