Systems and methods for optical data interconnection are described. One aspect includes a first signal converter that converts first high-speed HDMI electrical signals into high-speed HDMI optical signals, and transmits the optical signals over a first optical communication channel. A second signal converter encodes first low-speed HDMI electrical signals, converts these encoded signals into low-speed HDMI optical signals, and transmits these optical signals over a second optical communication channel. A third signal converter receives the high-speed HDMI optical signals, and converts these optical signals to second high-speed HDMI electrical signals. A fourth signal converter receives the low-speed HDMI optical signals, converts these optical signals to second low-speed HDMI electrical signals, and decodes the second low-speed HDMI electrical signals.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

An apparatus, system and method for providing an optical coupler. The optical coupler may be a miniature fiber optic coupler, which may include: a housing having dimensions of less than 4 mm×4 mm×4 mm; an input into the housing capable of receiving a fiber optic sending line; a sending line prism having dimensions of less than 2 mm×2 mm within the housing in optical communication with the sending line; a receiving line prism having dimensions of less than 2 mm×2 mm in optical communication with the sending line prism at a corresponded angle in a range of 30 to 60 degrees and capable of receiving a signal incoming on the sending line and redirecting the received signal; and a receiving line in optical communication with the receiving line prism and capable of receiving and outputting the redirected received signal.

An optically-monitored and/or optically-controlled electronic device is described. The device includes at least one of a semiconductor transistor or a semiconductor diode. An optical detector is configured to detect light emitted by the at least one of the semiconductor transistor or the semiconductor diode during operation. A signal processor is configured to communicate with the optical detector to receive information regarding the light detected. The signal processor is further configured to provide information concerning at least one of an electrical current flowing in, a temperature of, or a condition of the at least one of the semiconductor transistor or the semiconductor diode during operation.

An integrated transceiver module may be configured to convert optical signals received by optical transmission media of the hybrid optical/electrical connector and convert such optical signals into equivalent electrical signals and drive such equivalent electrical signals to electrically-conductive conduits of the electrical connector and convert electrical signals received by electrically-conductive conduits of the electrical connector and convert such electrical signals into equivalent optical signals and drive such equivalent optical signals to the optical transmission media of the hybrid optical/electrical connector, such that the device can communicate with a hybrid optical/electrical port of an information handling system via the cable.

A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.

An optically-monitored and/or optically-controlled electronic device is described. The device includes at least one of a semiconductor transistor or a semiconductor diode. An optical detector is configured to detect light emitted by the at least one of the semiconductor transistor or the semiconductor diode during operation. A signal processor is configured to communicate with the optical detector to receive information regarding the light detected. The signal processor is further configured to provide information concerning at least one of an electrical current flowing in, a temperature of, or a condition of the at least one of the semiconductor transistor or the semiconductor diode during operation.

An optical wireless communication (OWC) interface apparatus comprises: at least one input and/or output configured to transfer data signals from and/or to a bus device; optical interface circuitry configured to transfer optical wireless communication (OWC) signals representative of the data signals between the OWC interface apparatus and a light transmitter and/or receiver apparatus, wherein the light transmitter and/or receiver apparatus is configured to transmit and/or receive the OWC signals as free-space light signals; and interface control circuitry that is configured to establish and/or maintain communication with the bus device in accordance with a bus protocol thereby to enable transfer of the data signals between the OWC interface apparatus and the bus device.

An on-board communication system includes an optical coupler that includes multiple optical transmission lines, and multiple on-board devices that are capable of communicating with each other with the optical coupler interposed therebetween.

A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.