An optical transmitter includes photonic integrated circuits configured to respectively output optical transmission signals in different wavelength ranges. A photonic integrated circuit may include emitters configured to emit beams having different wavelengths; drivers configured to respectively provide power to the emitters, and a wavelength division multiplexer configured to transmit the beams emitted by the emitters. A photonic integrated circuit may include a switch device that controls the drivers, and light detectors configured to detect intensities of the beams emitted from the emitters. The switch device may selectively operate at least one driver of the plurality of drivers based on information associated with intensities of the beams. The switch device may selectively operate a driver connected to an emitter, based on a determination that an intensity of a beam emitted by another emitter is less than a threshold intensity value.

An optical component includes a light emitter; an optical receiver; first and second electro-optical crystal layers configured to intersect with each other; and a control line configured to supply a signal for changing refractive indexes of the first and second electro-optical crystal layers, wherein the first and second electro-optical crystal layers are switched according to the signal between a first state where light from the light emitter is transmitted through the first electro-optical crystal layer and a second state where the light is reflected by the first and second electro-optical crystal layers and the reflected light is incident on the optical receiver.

The present invention relates to a two-end driving, high-frequency sub-substrate structure, comprising a sub-substrate body, wherein: the sub-substrate body has an upper side provided with a first signal pad area and a second signal pad area, the first signal pad area and the second signal pad area are symmetric with respect to each other, each of the first signal pad area and the second signal pad area extends from one of two lateral portions of the sub-substrate body in an extending direction toward a center of the sub-substrate body and terminates in an end, the end of the first signal pad area is adjacent to but spaced from the end of the second signal pad area, the first signal pad area is configured for supporting a semiconductor chip provided thereon, the second signal pad area is provided with a jumper wire connected to an electrode of the semiconductor chip, there are two grounding pad areas provided respectively on two lateral sides of the first signal pad area and the second signal pad area and constituting a portion of a coplanar waveguide, the sub-substrate body has an inner layer or bottom side that is provided with a grounding layer or combined with a grounding layer.

An optical module, a communication device, and a Power over Ethernet (PoE) device are provided. The optical module includes a housing, an optical component, and a power supply component. The housing has a first socket and a second socket. The optical component also includes a first optical connector, an optical-to-electrical conversion component, and a second optical connector that are sequentially connected. The power supply component includes a first electrical connector, a power supply line, and a second electrical connector that are sequentially connected. The first socket is configured to insert a composite cable that matches the optical module. A power connector of the composite cable can be connected to the communication device by using the optical module, and the power connector of the composite cable does not need to be inserted into the communication device, so that panel space of the communication device can be reduced and miniaturization facilitated.

A mobile device includes an image sensor separated from a processing component by an open space. The image sensor includes one or more light source modules and the processing component includes one or more light sensors aligned with the one or more light source modules. Image data from the image sensor may be transmitted to the processing component via light signals exchanged between the one or more light source modules and the one or more light sensors. In some embodiments, light signals transmitted between one or more light source modules of an image sensor and one or more light sensors of the processing component are used to determine positional and angular data about the image sensor.

An electro-optical sensor comprises an optical input configured to receive an optical carrier via an upstream fiber. The electro-optical sensor also includes an optical modulator configured to modulate an electrical signal onto the optical carrier to create an optical signal. The electro-optical sensor further includes an optical output configured to transmit the optical signal via a downstream fiber. The electro-optical sensor employs a variation output configured to transmit variation data indicating variation in the received optical carrier to support compensation for corresponding variation in the optical signal.

An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.

A light guiding device for applying to silicon photonics structure is provided. The light guiding device includes an optical transceiver and a reflective structure. The reflective structure is disposed on the optical transceiver. The reflective structure has a reflective surface facing the optical transceiver, and the reflective surface is used for reflecting at least one light transmitted between the optical transceiver and a waveguide structure of the silicon photonics structure.

A rotary joint includes a fixed unit and a rotating unit arranged substantially orthogonal to a center axis and facing one another, as well as a substantially cylindrical light guide member arranged therebetween. A light-emitting device and a light-receiving device are provided on each of the units. The light guide member is configured such that an amount of the light from the light-emitting device on the fixed unit that is received by the light-receiving device on the rotating unit and an amount of the light from the light-emitting device on the rotating unit that is received by the light-receiving device on the fixed unit both exceed a prescribed minimum amount regardless of rotational positions of the rotating unit.

A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.