A method for co-packaging multiple light engines in a switch module is provided. The method includes providing a module substrate with a minimum lateral dimension no greater than 110 mm. The module substrate is configured with a first mounting site at a center region and a plurality of second mounting sites distributed densely along the peripheral sides. The method includes disposing a main die with a switch processor chip at the first mounting site. The switch processor chip is configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. The method further includes mounting a plurality of chiplet dies respectively into the plurality of second mounting sites. Each chiplet die is configured to be a packaged light engine with a minimum lateral dimension to allow a maximum number of chiplet dies with <50 mm from the main die for extra-short-reach data interconnect.

A transparent optical overlay network (1) for providing end-to-end optical spectrum services over multiple transparent optical network domains (2) is described. The transparent optical overlay network (1) includes network domain interface devices, NDIDs, (3) provided at domain boundaries between adjacent transparent optical network domains (2). The network domain interface device, NDID (3), monitors and adjusts incoming optical signals received by the NDID (3) from a first transparent optical network domain (2-1) and monitors and adjusts outgoing optical signals output by the NDID (3) to an adjacent second transparent optical network domain (2-2). An overlay network controller (5) manages and controls the end-to-end optical spectrum services by controlling the NDIDs (3). The overlay network controller collects telemetry data (TDATA) for optical spectrum service characterization and SLA policing of the optical spectrum services.

A large-scale array of interleaved optoelectronic transmitters and receivers are integrated on the surface of a common substrate with integrated circuits. The interleaved configuration allows the optimization of a channel pair.

A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

Systems and methods are provided for achieving graceful bandwidth scaling (i.e. higher data transmission rates) for Coarse Wavelength Division Multiplexing (CWDM) and CWDM-4 technologies. Examples utilize a waveband architecture built around the CWDM wavelengths. This waveband architecture adds additional wavelength transmission channels (which may equate to faster data transmission rates) while maintaining backwards compatibility with existing CWDM/CWDM-4 technologies. Examples may include waveband devices (e.g. waveband light sources, waveband transmitters, waveband receivers, waveband transceivers, etc.) designed to operate with one or more CWDM wavebands while maintaining backwards compatibility with existing CWDM-4 technologies.

A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

A method and system for fiber optic communication and sensing (FOCS) may include transmitting one or more measurement signals from an interrogator unit that is optically connected to a proximal wavelength division multiplexer (WDM), transmitting one or more communication signals from an information handling system that is optically connected to a proximal wavelength division multiplexer (WDM), multiplexing the one or more measurement signals and the one or more communication signals with the proximal WDM into a first fiber optic cable, and receiving the one or more measurement signals and the one or more communication signals with a distal WDM that is optically connected to the first fiber optic cable. The method may further include multiplexing the one or more measurement signals from the first fiber optic cable into one or more downhole sensing fibers and receiving backscatter light from at least one of the one or more downhole sensing fibers.

A redundancy system for data transport in a Distributed Antenna System (DAS) includes a plurality of Digital Access Units (DAUs). Each of the plurality of DAUs is fed by a plurality of data streams and is operable to transport digital signals between others of the plurality of DAUs. The redundancy system also includes a plurality of Digital Distribution Units (DDUs). Each of the plurality of DDUs is in communication with each of the plurality of DAUs using cross connection communication paths. The redundancy system further includes a plurality of Digital Remote Units (DRUs). Each of the plurality of DRUs is in communication with each of the plurality of DDUs using cross connection communications paths.

A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

A photonic chip includes a device layer and a port layer, with an optical port located at the port layer. Inter-layer optical couplers are provided for coupling light between the device and port layers. The inter-layer couplers may be configured to couple signal light but block pump light or other undesired wavelength from entering the device layer, operating as an input filter. The port layer may accommodate other light pre-processing functions, such as optical power splitting, that are undesirable in the device layer.